Sr Manager Design Development Technical Leadership, HBM

Design Development Technical Lead (DDTL) is accountable for predictable timely delivery of HBM design achievements across the design phase of the product lifecycle. This role serves as the singlethreaded technical program owner for HBM Design execution coordinating across DRAM base die test vehicles interposers IP and foundries(internal and external).

Operating within Microns Heterogeneous Integration Group (HIG) the DDTL leads crossfunctional execution manages design dependencies and risks owns change control and represents HBM Design in PDT and executive forums to ensure schedule cost quality and product objectives are met

Responsibilities

Design Program Ownership

• Own endtoend execution of on schedule delivery of HBM design achievements ensuring alignment across DRAM base die test chips PTVs interposers and sustaining designs.
• Be the primary design representative in PDT and executive reviews.
• Define and manage crossfunctional dependencies across all collaborators
• Lead execution governance including DDTL Syncs and Design Program Reviews (DPRs) providing clear executivelevel status risks and decision asks.
• Own and operate formal Change Control Board (CCB) processes ensuring disciplined POR management cost/schedule awareness and traceability.
• Maintain a comprehensive design risk register. Proactively identify risks lead mitigation workgroups define checkpoints and bring up issues through governance forums as required.
• Capture and institutionalize lessons learned to improve future program execution.
• Drive early engagement during architecture and design phases to enable shiftleft risk mitigation.
• Lead initiatives to optimize die size DFM yield cost power and manufacturing efficiency.
• Ensure HBM products meet bestinclass targets for performance power quality reliability and cost.

Foundry IP & External Partner Leadership

• Lead designphase engagement with external foundries and IP providers identifying and resolving execution dependencies.
• Own IP forecasting selection and prioritization aligning technical needs with budget and roadmap constraints.
• Lead design contractor IP vendor and procurement engagements supporting design execution.

Finance Budgeting & Cost Ownership

• Own designphase financial accountability for the HBM portfolio.
• Develop IP cost projections track actuals manage approvals and drive prioritization in alignment with design and business objectives.
• Manage mask cost planning and execution for test vehicles test chips and live die across TSMC and UMC nodes ensuring cost transparency and schedule alignment.

Roadmap Ownership & Communication

• Serve as the programlevel central owner of the HBM design roadmap.
• Maintain integrate and communicate roadmap updates across Design PDT and executive collaborators.

Customer & Executive Interface

• Capture customer requirements and schedules for customized HBM products and ensure execution alignment.
• Partner with Business Finance and Product teams to align design execution with roadmap and market priorities.
• Provide concise data-driven executive communications advancing critical issues when necessary.

Process Metrics & Continuous Improvement

• Define standardize and deploy program management tools and dashboards (e.g. Jira status templates CCB workflows).
• Monitor and report key execution metrics driving corrective actions and continuous improvement.
• Develop scalable business processes to support increasing portfolio complexity and design scope.

Qualifications

• Understanding of custom and digital design flows and the full SoC/DRAM development lifecycle.
• Demonstrated ability to lead large crossfunctional technical programs through influence and execution rigor.
• Experience working with foundries IP vendors and ecosystem partners.
• Knowledge of DRAM operation preferably within the HBM product family.
• Familiarity with industry standards and compliance requirements (e.g. JEDEC).

Preferred Qualifications

• 10 years of relevant industry experience.
• Bachelors degree in Electrical Engineering or a related field with equivalent experience considered.
• Strong analytical problemsolving and decisionmaking skills.
• Experience with formal program or project management methodologies.
• Strong executive communication skills and ability to operate effectively in a fastpaced dynamic environment.