Bump Packaging Engineer
Pampanga - Philippines
Job Summary
Change the world. Love your job.
As a member of our packaging team youll have the chance to interact with many product groups and functions. Youll have high visibility on your projects with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
- Develop new package requirements and maintaining quality of existing packages for all product groups
- Define package requirements for product groups and customer requirements
- Develop new package and process qualification programs.
- Perform integrity analysis of packages utilizing appropriate tools
- Perform package characterizations including cost effectiveness studies.
- Act as a liaison with vendors
- Maintain product quality while developing and introducing package cost reduction programs
- Coordinate the introduction of new package processes into production
- Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
Qualifications
Minimum requirements:
- Bachelors degree in Materials Engineering Applied Physics Chemical Engineering
- Minimum 5 years of relevant experience in Program Management Ball Attach (Athlete) and AVI (Camtek) Photolithgraphy Plasma and Vacuum Technology Plating
Preferred qualifications:
- Ability to establish strong relationships with key stakeholders critical to success both internally and externally
- Strong verbal and written communication skills
- Ability to quickly ramp on new systems and processes
- Demonstrated strong interpersonal analytical and problem-solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Autocad Cadence Ansys similar Modelling tools
Required Experience:
IC
Key Skills
About Company
Why TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation ... View more