Assembly Technical Program Manager

NXP Semiconductors

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profile Job Location:

Bangkok - Thailand

profile Monthly Salary: Not Disclosed
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

Role Summary

Excellence knowledge Mold process or Backend process of semiconductor.
Lead for mold technical expert and improvement.
Perform improvement projects follow goals and KPI that focus improve quality cost delivery.
Proven track record in optimizing manufacturing processes using Lean Six Sigma.
Create and review process specification example control plan process spec PFMEA bonding diagram etc.
Manage mold team to improvement

Job Responsibility

Troubleshoot molding processes and material or equipment issues
Provide engineering support in terms of production & quality issues to ensure issues are contained and resolved.
Prepare instructions/procedures for assembly processes ECN/CMT are drafted & executed.
Enhance and optimize molding process to achieve Quality Delivery and Cost-efficient production with Standardization.
Act as engineering resource to molding operation ensuring process standardization and Responsible for new tooling/autoloader process set up / Optimization of existing process.
Collect and analyze data on individual processes to identify and improve process capability.
Collaborate with other related departments to ensure the process / equipment maintenance activities.

Job Qualification

Bachelors or Masters degree in Electronics Electrical Mechanical Materials Engineering or a related field.

Mold or Backend process more than 10 Years experience in Semiconductor industry.
Minimum 10 years experience in high precision injection molding and hands-on experience in Molding Process set up and optimization.
Proven ability to lead mold improvement process standardization and recipe development activities.
Proficient in process validation methodologies and techniques.
Skilled in using DOE SPC tools Cpk analysis and process validation methodologies.
Effective communication skills in both Thai and English with the ability to collaborate across crossfunctional teams.
Demonstrated leadership capability to coach team members and drive continuous improvement culture.
Proactive selfdriven mindset with strong project management capability.
Ability to work under pressure in fastpaced manufacturing environments.


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Required Experience:

Manager

Role SummaryExcellence knowledge Mold process or Backend process of semiconductor.Lead for mold technical expert and improvement.Perform improvement projects follow goals and KPI that focus improve quality cost delivery.Proven track record in optimizing manufacturing processes using Lean Six Sigma.C...
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Key Skills

  • Project Management Methodology
  • Project / Program Management
  • Program Management
  • Management Experience
  • Microsoft Powerpoint
  • Project Management
  • Microsoft Project
  • Budgeting
  • DoD Experience
  • Leadership Experience
  • Supervising Experience
  • Contracts

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NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.

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