Front End Central Product Integration (FE cPIE) MTS (FE)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

Job Responsibilities:

• Lead process integration (PI) structural uniformity and crossloop integration for critical modules (e.g. capacitance loop) owning endtoend integration strategies to resolve yield quality and reliability gaps. Drive physics and processbased integration solutions through close collaboration with crossmodule process owners PI subjectmatter experts and key suppliers to optimize integration structures and achieve BIC yield and quality targets.

• Develop and apply modelbased root cause analysis frameworks (transport reaction kinetics pattern density and geometrydependent effects) to diagnose structural nonuniformity. Define implement and continuously strengthen critical inline monitoring and defense lines (CD film loss mass delta defectivity edge/periphery metrics) to ensure robust control of structural uniformity.

• Own and advance product integration programs and looplevel domain expertise maintaining deep technical knowledge across node transitions. Proactively drive nodeovernode shiftleft integration including early implementation of uniformity bevel and backside bestknownmethods (BKMs) during development phases to accelerate wholewafer (centertoedge) yield and quality ramp.

• Drive worldwide technical alignment and execution excellence by leading global projects standardizing and leveraging network BKMs and scaling proven solutions across sites. Identify efficiency and performance gaps and lead business process creation optimization and reengineering to improve benchmark performance cycle time and development productivity.

Job Requirements:

• Good logical thinking and knowledge in Semiconductor Fabrication process flows interaction of different processes and how changes affect yield device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric probe and qual data from both front end and backend assembly process.

• Good model based problem solving together with data driven decision making and presentation skills. Proven ability to troubleshoot and solve structure and device related issues and address root cause.

• Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face to face collaboration.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good multi-tasking verbal and written communication skills.

• With more than 7 years relevant industries experience / knowledges.

• Bachelors/Masters/ EE Materials Engineering Materials Science Physics and Chemical but optional if candidates have more than 10 years experience in process related role in semiconductor industry.

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

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