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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
The Package HealthAnalystwill contribute to the development and execution of package health monitoring simulation and characterization activities. This role involves hands-on engineering work in DFT data analysis and reliability testing to ensure robust packaging solutions.
Key Responsibilities
Package Health Metrics & Monitoring
Define quantitative package health metrics
Develop detection mechanisms andmonitoringdashboards for continuous health assessment.
Perform electrical and mechanical characterization of packages.
Inline Defect Characterization
Implement real-time defect detection and classification (critical vs. non-critical).
Conduct next-level characterization for critical defects and integrate findings into predictive models.
Advanced Analytics & Knowledge Base
Perform correlation and causation studies between process variables defect patterns and reliability outcomes.
Build and maintain a structured knowledge base for package health learnings to enable NPI handover and futuretechnodes.
End-to-End Traceability
Collaborate with process and equipment engineers to establish traceability across wafer assembly and test stages.
Develop data pipelines and tools for linking process parameters equipment signals and defect signatures.
Qualifications
Bachelors orMasters degree in Electrical Engineering Materials Science or relatedfield.
3 years of experience insemiconductor industry (complex products preferred) preferably in packagingtest or reliability engineering.
Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualizationis a plus
Strong understanding of semiconductor packagingprocess materialinteractionand properties.
Ability to work cross-functionally with process equipment and reliability teams.
Additional/Preferred Qualifications
Experience with AI/ML tools or statistical modeling.
Knowledge of defect inspection systems and inline metrology.
Familiarity with advanced packaging technologies (HBM hybrid bonding 2.5D/3D stacking).
Strong problem-solving and documentation skills
About Micron Technology Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.
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Required Experience:
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