Product Engineer
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Job Location:
Taipei City - Taiwan
Monthly Salary:
Not Disclosed
Posted on:
17 hours ago
Vacancies:
1 Vacancy
Job Summary
Work Schedule
Standard (Mon-Fri)Environmental Conditions
OfficeJob Description
As part of the Thermo Fisher Scientific team youll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life every single day to enable our customers to make the world healthier cleaner and safer. We provide our global teams with the resources needed to achieve individual career goals while helping to take science a step beyond by developing solutions for some of the worlds toughest challenges like protecting the environment making sure our food is safe or helping find cures for cancer.
Location: Taoyuan
Division: Clinical Sequencing Division
About the Role
We are seeking a Chip Assembly Product Engineer to support new product introduction (NPI) assembly yield improvement and production ramp of semiconductor devices used in advanced scientific instrumentation.
This role bridges design wafer fabrication OSAT assembly and test to ensure robust manufacturable and high-yielding products from first silicon through volume production.
This is a hands-on engineering role ideal for candidates with 04 years of semiconductor assembly packaging or product engineering experience.
Key Responsibilities
Support product bring-up from wafer sort through final assembly and test
Work with OSAT partners to ensure process capability and yield targets
Monitor assembly yield analyze defect paretos and drive root cause investigations
Coordinate failure analysis activities (CSAM X-ray cross-section SEM etc.)
Support reliability qualification
Assist in resolving manufacturing excursions and yield loss
Review and maintain assembly documentation and process flows
Collaborate with Design Test Engineering Quality and Supply Chain teams
Required Qualifications
Bachelors or Masters degree in Electrical Engineering Materials Science Mechanical Engineering Physics or related field
04 years of experience in semiconductor assembly packaging product engineering or related manufacturing environment
Understanding of semiconductor assembly processes (die attach wirebond molding singulation etc.)
Experience analyzing yield data and supporting root cause investigations
Strong analytical and problem-solving skills
Strong written and verbal English communication skills (required for global collaboration)
Preferred Qualifications
Experience working with OSAT vendors
Exposure to failure analysis tools (CSAM X-ray cross-sectioning)
Knowledge of package reliability and defect mechanisms
Experience supporting NPI or production ramp
What You Will Gain
Exposure to full product lifecycle from development to high-volume manufacturing
Direct interaction with global engineering teams
Hands-on experience in semiconductor assembly and reliability engineering
Career growth within a global technology organization
Required Experience:
IC
Key Skills
- APQP
- Six Sigma
- GD&T
- Root cause Analysis
- CAD
- Project Leadership
- SolidWorks
- Mechanical Engineering
- Quality Management
- Product Development
- Catia
- Manufacturing
About Company
Electron microscopes reveal hidden wonders that are smaller than the human eye can see. They fire electrons and create images, magnifying micrometer and nanometer structures by up to ten million times, providing a spectacular level of detail, even allowing researchers to view single a ... View more
