Technology development engineer – AIT (Assembly Interconnection Technology)

Key responsbilities :

• Research develop and implementation of Assembly and Interconnect Technology (AIT) processes for electronic modules such as sealing thermal management component fixation electronics protection (conformal coating potting molding) and surface treatment (plasma laser finishing wet chemical cleaning etc.)
• Preparation of process development plan estimation of effort time & sample demand and release of contracting
• Collaborating with the design team by analyzing product design & drawings and providing key insights to ensure the design is optimized for manufacturing and assembly (DFMA)
• Defining DOEs plan & conduct trials analyzing the results and create detailed technical documentation
• Conducting technical reviews and active contributions in DFMEA PFMEA & DFMA reviews to identify and mitigate risks early in the development cycles
• Release of process specification for manufacturing proving process capability
• Defining optimizing and scaling up processes for series production
• Coordinate development tasks with internal and external interfaces including design teams project management suppliers manufacturing plants and customers to ensure seamless integration and alignment
• Deviation assessment risk estimation and provide risk assessment to project
• Collaborating with international specialized and competence teams
• Collaborating with production plant for series support

Technical expertise (Must-Have)

• Proven experience in one or more of the following: ECU sealing thermal management for electronics component fixation techniques or electronics protection (conformal coating potting over molding).
• Strong understanding of surface treatment methods (plasma laser wet chemical cleaning)
• Practical experience with quality and risk analysis tools such as DFMEA PFMEA and DFMA
• Good knowledge on Plastics or die cast or sheet metal
• Good understanding of statistical methods and hands on experience

Technical expertise (Desired)

• Familiarity with automotive industry standards and validation requirements
• Experience with CAD visualisation software (Team center) & statistical tools (minitab)
• German language A1

Soft skills:

• Good Problem-solving & analytical skills and method knowledge
• Self-driven and initiative quick learner and passionate to work in the challenging environment.
• Strong communication and interpersonal skills with the ability to work effectively in cross-functional teams.
• Team player with product-centric mindset

Qualifications :

B .Tech/B.E/M Tech Electronics and Communication/Electrical engg

Additional Information :

Location:                        Bengaluru 

Qualification:                 B.E/ in Material science (preferred)/Mechanical engineering

Experience:                     

3-5 years of hands-on experience in electronics packaging assembly processes or interconnection technology development

Remote Work :

No

Employment Type :

Full-time