Bosch Research is seeking an intern to support development of printed metal-oxide (MOx) sensing materials for gas sensing. The intern will help establish a reliable fabrication workflow that combines piezo dispensing / inkjet printing with wire bonding and packaging practices suitable for small MEMS-based sensor substrates.
In this role you will:
- Operate and develop procedures for piezo or inkjet deposition of MOx inks on small substrates/MEMS chips.
- Assist in ink formulation optimization (solvent/binder/dispersant solids loading filtration stability) in collaboration with UC Berkeley partners.
- Develop and document printing process parameters (patterning approach drop spacing passes substrate mounting drying/curing steps inspection/QC).
- Perform and document wire bonding procedures for printed sensor substrates (process setup parameter optimization yield tracking basic failure analysis).
- Support experimental logistics and coordination for occasional work at Stanford (SNF) and UC Berkeley (e.g. tool access sample transport on-site runs as needed).
- Maintain organized experimental records and deliver clear runbooks (SOP-style documentation) to improve repeatability.
The internship emphasizes hands-on lab work process development and collaboration across academic and industry teams.
Qualifications :
Required Qualification:
- Currently pursuing a BS MS or PhD in Chemical Engineering Materials Science Mechanical Engineering Electrical Engineering Chemistry or a related field.
- Hands-on lab experience with at least one of the following: thin film/coatings nanoparticle dispersions microfabrication printing/dispensing or device assembly.
- Strong attention to detail and good experimental hygiene (clean handling contamination control documentation).
- Ability to work 100% onsite in Sunnyvale CA for the duration of the internship.
- Strong communication and teamwork skills; ability to work independently with guidance.
- Minimum GPA of 3.0
Desired Qualification:
- Experience with inkjet / piezo dispensing / microarray spotting or other precision deposition tools.
- Experience with nanoparticle ink formulation (dispersion stability rheology filtration surfactants/binders).
- Experience with wire bonding (ball or wedge bonding) die handling or basic packaging/assembly.
- Familiarity with surface wetting contact angle drying/coffee-ring effects or basic microscopy/inspection methods.
- Comfortable analyzing and plotting data in Python/Excel (nice to have)
Additional Information :
Equal Opportunity Employer including disability / veterans
The U.S. base salary range for this intern position is $31.00-$64.00. Within the range individual pay is determined based on several factors including but not limited to type of degree work experience and job knowledge complexity of the role type of position job location etc. Your Hiring Manager can share more details about the specific salary range for this position during the interview process
*Bosch adheres to Federal State and Local laws regarding drug-testing. Employment is contingent upon the successful completion of a drug screen and background check. Candidates who have been offered the position must pass both screenings before their start date.
BOSCH is a proud supporter of STEM (Science Technology Engineering & Mathematics)
- FIRST Robotics (For Inspiration and Recognition of Science and Technology)
- AWIM (A World In Motion)
For more information on our culture and benefits please visit:
Culture and Benefits Bosch in the USA
Remote Work :
No
Employment Type :
Contract
Bosch Research is seeking an intern to support development of printed metal-oxide (MOx) sensing materials for gas sensing. The intern will help establish a reliable fabrication workflow that combines piezo dispensing / inkjet printing with wire bonding and packaging practices suitable for small MEMS...
Bosch Research is seeking an intern to support development of printed metal-oxide (MOx) sensing materials for gas sensing. The intern will help establish a reliable fabrication workflow that combines piezo dispensing / inkjet printing with wire bonding and packaging practices suitable for small MEMS-based sensor substrates.
In this role you will:
- Operate and develop procedures for piezo or inkjet deposition of MOx inks on small substrates/MEMS chips.
- Assist in ink formulation optimization (solvent/binder/dispersant solids loading filtration stability) in collaboration with UC Berkeley partners.
- Develop and document printing process parameters (patterning approach drop spacing passes substrate mounting drying/curing steps inspection/QC).
- Perform and document wire bonding procedures for printed sensor substrates (process setup parameter optimization yield tracking basic failure analysis).
- Support experimental logistics and coordination for occasional work at Stanford (SNF) and UC Berkeley (e.g. tool access sample transport on-site runs as needed).
- Maintain organized experimental records and deliver clear runbooks (SOP-style documentation) to improve repeatability.
The internship emphasizes hands-on lab work process development and collaboration across academic and industry teams.
Qualifications :
Required Qualification:
- Currently pursuing a BS MS or PhD in Chemical Engineering Materials Science Mechanical Engineering Electrical Engineering Chemistry or a related field.
- Hands-on lab experience with at least one of the following: thin film/coatings nanoparticle dispersions microfabrication printing/dispensing or device assembly.
- Strong attention to detail and good experimental hygiene (clean handling contamination control documentation).
- Ability to work 100% onsite in Sunnyvale CA for the duration of the internship.
- Strong communication and teamwork skills; ability to work independently with guidance.
- Minimum GPA of 3.0
Desired Qualification:
- Experience with inkjet / piezo dispensing / microarray spotting or other precision deposition tools.
- Experience with nanoparticle ink formulation (dispersion stability rheology filtration surfactants/binders).
- Experience with wire bonding (ball or wedge bonding) die handling or basic packaging/assembly.
- Familiarity with surface wetting contact angle drying/coffee-ring effects or basic microscopy/inspection methods.
- Comfortable analyzing and plotting data in Python/Excel (nice to have)
Additional Information :
Equal Opportunity Employer including disability / veterans
The U.S. base salary range for this intern position is $31.00-$64.00. Within the range individual pay is determined based on several factors including but not limited to type of degree work experience and job knowledge complexity of the role type of position job location etc. Your Hiring Manager can share more details about the specific salary range for this position during the interview process
*Bosch adheres to Federal State and Local laws regarding drug-testing. Employment is contingent upon the successful completion of a drug screen and background check. Candidates who have been offered the position must pass both screenings before their start date.
BOSCH is a proud supporter of STEM (Science Technology Engineering & Mathematics)
- FIRST Robotics (For Inspiration and Recognition of Science and Technology)
- AWIM (A World In Motion)
For more information on our culture and benefits please visit:
Culture and Benefits Bosch in the USA
Remote Work :
No
Employment Type :
Contract
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