Career Accelerator Program Packaging Engineer MSPhD
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Job Location:
Dallas, IA - USA
Monthly Salary:
Not Disclosed
Posted on:
Yesterday
Vacancies:
1 Vacancy
Job Summary
Change the world. Love your job.
In your first year with TI you will participate in the Career Accelerator Program (CAP) which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.
Interface across various work areas and organizations to help with the design development and analysis of different semiconductor packaging technologies to enable differentiation for TIs analog and embedded processing products. TIs innovative packaging technologies are designed to solve customers problems by delivering advances in miniaturization integration high reliability high performance and low this role youll get the opportunity to thrive in a fast paced dynamic environment where high-energy prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following responsibilities:
- Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies including Wirebond Flip Chip Modules SIPs and other advanced packages at different stages of readiness
- Participate in cross-functional teams supporting product qualification and production helping to meet reliability and yield requirements design testability and test coverage
- Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
- Conduct electrical mechanical thermal models to comprehend silicon-to-package interaction establish design rules and to predict and prevent the use of high risk designs.
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industrys top engineering minds at your disposal. TIs corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect dignity kindness and courtesy.
Put your talent to work with us as a Packaging engineer !
Qualifications
Minimum Requirements:
- Masters degree in Mechanical Engineering Physics or related
- Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications:
- Cumulative 3.5/4.0 GPA or higher
- Demonstrated expertise in mechanical stress analysis and management
- Hands-on experience in mechanical stress modeling using industry software such as ANSYS
- Hands-on experience or working knowledge on mechanical characterization of materials (metals/alloys polymers ceramics etc.)
- Semiconductor back-end-of-line processing knowledge is preferred (fab manufacturing processes for Al and Cu based back-end-of-line)
- Semiconductor packaging knowledge is preferred (manufacturing processes assembly reliability materials characterization FA)
- Demonstrated analytical and problem solving skills
- Strong written and verbal communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Ability to build strong influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
Required Experience:
IC
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
Why TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation ... View more
