DescriptionChange the world. Love your job.
Do you want to work for an organization that values your opinion Do you want to work for an organization where you can play a pivotal role in several different areas Look no further. As a Texas Instruments Wire Bond Equipment Engineer you will have the opportunity to work in a vibrant and dynamic team oriented environment.
Responsibilities include:
- Evaluating selecting and ordering equipment that is most appropriate and cost effective for the manufacture of company products
- Overseeing the installation modification upgrade and maintenance of manufacturing equipment
- Keeping current on equipment manufacturers technical notices upgrades and safety issues
- Studying equipment performance and reliability
- Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
- Providing technical support to the manufacturing equipment repair and process engineering organizations
- Defining and writing preventative maintenance schedules
QualificationsMinimum Requirements:
- Bachelordegree of electronics or electrical engineeringMechanical Engineering or related engineering degree
- Minimum 3 years as Wire bond Equipment Engineer with KNS and ASM wire bond equipment maintenance experience in semiconductor manufacturing operations
- Equipped with Wire bond process experiences will be added advantage
- Work Arrangement: Full-time onsite role based at Texas Instruments Malaysia Batu Berendam Malacca.
Preferred Qualifications:
- Equipment experience with Wire bond process must be able to hand on KNS and ASM wire bond machine
- Prior experience withGold/Cu/PCC wire& Bump ball process bonding
- Equipment experience on other equipment post wire bond process (e.g. plasma Die coat)
- Experience on tool monitoring and interdiction software and equipment maintenance and documentation
- Working knowledge of semiconductor manufacturing and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviors.
- Strong verbal and written communication skills
- Demonstrated strong analytical critical thinking and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Ability to work effectively in an interrupt-driven fast-paced and rapidly changing environment
- Demonstrated ability to build strong influential relationships
Required Experience:
Senior IC
DescriptionChange the world. Love your job.Do you want to work for an organization that values your opinion Do you want to work for an organization where you can play a pivotal role in several different areas Look no further. As a Texas Instruments Wire Bond Equipment Engineer you will have the oppo...
DescriptionChange the world. Love your job.
Do you want to work for an organization that values your opinion Do you want to work for an organization where you can play a pivotal role in several different areas Look no further. As a Texas Instruments Wire Bond Equipment Engineer you will have the opportunity to work in a vibrant and dynamic team oriented environment.
Responsibilities include:
- Evaluating selecting and ordering equipment that is most appropriate and cost effective for the manufacture of company products
- Overseeing the installation modification upgrade and maintenance of manufacturing equipment
- Keeping current on equipment manufacturers technical notices upgrades and safety issues
- Studying equipment performance and reliability
- Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
- Providing technical support to the manufacturing equipment repair and process engineering organizations
- Defining and writing preventative maintenance schedules
QualificationsMinimum Requirements:
- Bachelordegree of electronics or electrical engineeringMechanical Engineering or related engineering degree
- Minimum 3 years as Wire bond Equipment Engineer with KNS and ASM wire bond equipment maintenance experience in semiconductor manufacturing operations
- Equipped with Wire bond process experiences will be added advantage
- Work Arrangement: Full-time onsite role based at Texas Instruments Malaysia Batu Berendam Malacca.
Preferred Qualifications:
- Equipment experience with Wire bond process must be able to hand on KNS and ASM wire bond machine
- Prior experience withGold/Cu/PCC wire& Bump ball process bonding
- Equipment experience on other equipment post wire bond process (e.g. plasma Die coat)
- Experience on tool monitoring and interdiction software and equipment maintenance and documentation
- Working knowledge of semiconductor manufacturing and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviors.
- Strong verbal and written communication skills
- Demonstrated strong analytical critical thinking and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Ability to work effectively in an interrupt-driven fast-paced and rapidly changing environment
- Demonstrated ability to build strong influential relationships
Required Experience:
Senior IC
View more
View less