We are seeking a Senior Process / Equipment Engineer Molding to develop sustain and continuously improve molding processes and equipment in a high-volume semiconductor manufacturing environment.
This role plays a key technical leadership position responsible for process robustness equipment performance yield improvement and technology readiness from development through High Volume Manufacturing (HVM). Experience supporting BIM lines is a strong advantage.
What You Will Do
Develop characterize optimize and sustain molding processes and equipment for semiconductor backend assembly.
Own molding process performance yield and equipment stability in production.
Provide technical leadership and guidance on molding-related topics within cross-functional teams.
Support New Product Introduction (NPI) process qualification and smooth ramp-up into HVM.
Drive continuous improvement initiatives to improve yield quality reliability UPH and cost efficiency.
Identify molding process integration risks and define mitigation plans using structured engineering methods.
Troubleshoot and resolve molding-related issues involving compound behavior tooling equipment and system interactions.
Collaborate closely with Process Equipment QA R&D NPI Product Design and Reliability teams.
Support molding compound selection evaluation and change management to ensure stable manufacturability.
Maintain and update technical documentation such as SOPs process specifications control plans FMEAs and technical reports.
Contribute to technology and package roadmaps through benchmarking studies and data-driven recommendations.
Provide technical support to internal stakeholders and external customers when required.
Perform effectively in a fast-paced high-volume manufacturing environment.
What You Will Need
Bachelors degree in engineering or a related technical discipline.
Minimum 5 years of semiconductor manufacturing experience with strong focus on molding processes and equipment.
Strong understanding of backend assembly molding processes including compound flow curing behavior and defect mechanisms.
Hands-on experience with molding tooling; experience with Lauffer molding systems is a strong advantage.
BIM line experience is a plus.
Knowledge of molding compound properties interactions and material behavior.
Familiarity with Six Sigma DOE SPC FMEA 8D and statistical analysis tools.
PLC knowledge or system-level understanding is a significant advantage.
Strong analytical troubleshooting and structured problem-solving skills.
Excellent communication and interpersonal skills with good command of English.
Ability to work effectively across functions and influence without authority.
Self-motivated proactive customer-focused with a strong ownership mindset.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.
In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Required Experience:
Senior IC
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.