Wafer Saw Engineer
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Job Location:
Monthly Salary:
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
About the Role
We are looking for a motivated and technically skilled Wafer Saw Engineer to support the development optimization and sustaining of wafer dicing processes in a semiconductor manufacturing environment. This role focuses on improving process stability productivity and product quality while supporting high-volume manufacturing operations. The engineer will work closely with cross-functional teams to troubleshoot issues implement process improvements and evaluate new technologies and consumables.
What You Will Do
Develop optimize and sustain wafer dicing recipes parameters and cutting conditions.
Monitor key process indicators such as feed rate spindle revolution cutting quality and blade wear rate to ensure process stability and product quality.
Conduct root cause analysis for process issues using structured methodologies such as 5 Why Fishbone Diagram DOE and SPC.
Create and maintain engineering documentation including SOJT FMEA control plans and equipment maintenance procedures.
Drive productivity and cost improvement initiatives such as recipe standardization blade life optimization consumable cost reduction and cycle time improvement.
Evaluate qualify and introduce new technologies blades and consumables to enhance process performance.
Work closely with manufacturing equipment engineering and quality teams to resolve process-related issues and improve yield.
Ensure compliance with process control standards and support continuous improvement initiatives.
What You Will Need
Education
Bachelors Degree in Engineering (Mechanical Electrical Electronics Mechatronics Materials Semiconductor Engineering or related field).
Experience
25 years of experience in semiconductor wafer dicing or a related manufacturing environment.
Hands-on experience with wafer saw equipment (DISCO machines preferred) is an advantage.
Technical Skills
Good understanding of wafer dicing fundamentals including spindle revolution blade grit blade exposure cooling methods and cutting methods.
Familiar with engineering methodologies such as SPC DOE and FMEA.
Ability to interpret wafer maps engineering drawings and metrology reports (top side back chipping kerf width blade wear etc.).
Soft Skills
Ability to work independently with minimal supervision in a fast-paced manufacturing environment.
Strong analytical thinking and problem-solving skills.
Good communication and teamwork skills to collaborate with cross-functional teams.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.
In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Required Experience:
IC
Key Skills
About Company
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
