Design Release Engineer– Memory

Job Description

The Role

General Motors is at the forefront of the transformation of automotive with the electrification of our portfolio and the development of leading-edge central compute connectivity and autonomous capabilities. Our Semiconductor Engineering team is a dynamic high-energy and innovative group focused on design and commercialization of leading-edge silicon enabling the future of GMs Software Defined Vehicle (SDV) platformscentral compute units connectivity modules and other controllers.

We are seeking a Hardware Design Release Engineer (DRE)- Memory to lead sourcing design release change management specification and production readiness activities for our cutting-edge next generation memory semiconductors. Your efforts will be on the forefront of GMs most complex and interesting technological advancement contributing to our development in compute and connectivity technology. By collaborating and building strong partnerships with internal team members responsible for commercial negotiations electronic control unit (ECU) design as well as semiconductor partners you can push the boundaries of what we can do in compute and connectivity technology for our customers!

What Youll Do (Responsibilities):

• Support and lead the design development verification documentation and definition of our next generation memory semiconductors.
• Understand support and drive discussion on memory needs architecture and use cases with our vehicle architecture teams working on our Software Defined Vehicle (SDV) Architecture.
• Build partnerships and work closely with functional peers across semiconductor and ECU engineering purchasing and memory suppliers to implement semiconductor strategic objectives.
• Develop eSOR (Statement of Requirements) and release memory semiconductors to facilitate on-time sourcing and integration with ECUs in accordance with Global Vehicle Development Process and program timing requirements.
• Run Product Development Team (PDT) consisting of all internal and external partners ensuring semiconductors are designed produced and production ready.
• Build strong semiconductor fabrication partner relationships ensuring clear understanding of manufacturing process supply chain business arrangements.
• Project manage ongoing process/product design changes related to semiconductors within scope of responsibility and present progress to leadership.
• Establish domain expertise for semiconductors product line within scope of responsibility.

Your Skills & Abilities (Required Qualifications):

• Bachelors degree in Electrical Engineering or similar discipline.
• 3 total years of engineering experience in one or more of the following:
• As a Design Release Engineer for electronic hardware.
• At a semiconductor supplier (memory SoC MCU or related).
• At a Tier1 ECU supplier in hardware design or component engineering.
• Experience in electronic hardware design and development.
• Working knowledge of automotive electronic hardware and automotive software architecture.
• Proficiency in reading and reviewing schematics and PCB layouts; ability to collaborate effectively with hardware design teams even if not the primary designer.

People Skills:

• Demonstrated ability to lead cross functional projects to completion managing issues risks and timelines.
• Excellent collaboration and communication skills with a track record of working across functions (engineering purchasing suppliers quality manufacturing).

What Will Give You a Competitive Edge (Preferred Qualifications):

• Masters degree in Electrical Engineering or similar discipline.
• Previous experience with memory applications and design on a module or component level (e.g. DRAM LPDDR UFS/eMMC NOR/NAND MCP).
• Industry knowledge with the design and application of different semiconductors memory semiconductors.
• Experience in automotive or other safety critical high reliability industries.

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