Role & Responsibilities
- Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
- Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
- Drive continuous improvement initiatives focused on equipment performance process optimization and quality enhancement.
- Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
- Collaborate with cross-functional teams to support production goals improve equipment utilization and meet customer quality requirements.
- Develop innovative solutions and automation systems to enhance machine connectivity reduce manual intervention and improve operational efficiency.
- Provide technical training and mentorship to engineers on wire bond equipment troubleshooting overhaul and process control.
- Ensure compliance with environmental safety and quality standards in all equipment-related activities.
- Lead projects that deliver measurable improvements in productivity cost reduction and quality performance.
Qualification
- Education: Bachelors degree in Electronics Electrical Mechanical or related Engineering field.
- Experience: Minimum 7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
- Proven expertise in wire bond machine platforms.
- Strong background in machine overhaul rebuild calibration preventive and predictive maintenance.
- Demonstrated ability to manage major repairs restoration and equipment qualification.
- Solid understanding of quality systems SPC and root cause analysis for equipment-related issues.
- Experience in continuous improvement methodologies (Lean Six Sigma) and driving cost-reduction projects.
- Ability to develop and implement automation and innovative solutions for equipment and process improvement.
- Excellent analytical troubleshooting and problem-solving skills.
- Strong leadership and communication skills; ability to train and mentor technical teams.
- Familiarity with data analytics and machine connectivity projects is a plus.
More information about NXP in Thailand...
#LI-9599
Required Experience:
Senior IC
Role & ResponsibilitiesLead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.Drive continuous improvement initiatives focused on equip...
Role & Responsibilities
- Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
- Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
- Drive continuous improvement initiatives focused on equipment performance process optimization and quality enhancement.
- Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
- Collaborate with cross-functional teams to support production goals improve equipment utilization and meet customer quality requirements.
- Develop innovative solutions and automation systems to enhance machine connectivity reduce manual intervention and improve operational efficiency.
- Provide technical training and mentorship to engineers on wire bond equipment troubleshooting overhaul and process control.
- Ensure compliance with environmental safety and quality standards in all equipment-related activities.
- Lead projects that deliver measurable improvements in productivity cost reduction and quality performance.
Qualification
- Education: Bachelors degree in Electronics Electrical Mechanical or related Engineering field.
- Experience: Minimum 7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
- Proven expertise in wire bond machine platforms.
- Strong background in machine overhaul rebuild calibration preventive and predictive maintenance.
- Demonstrated ability to manage major repairs restoration and equipment qualification.
- Solid understanding of quality systems SPC and root cause analysis for equipment-related issues.
- Experience in continuous improvement methodologies (Lean Six Sigma) and driving cost-reduction projects.
- Ability to develop and implement automation and innovative solutions for equipment and process improvement.
- Excellent analytical troubleshooting and problem-solving skills.
- Strong leadership and communication skills; ability to train and mentor technical teams.
- Familiarity with data analytics and machine connectivity projects is a plus.
More information about NXP in Thailand...
#LI-9599
Required Experience:
Senior IC
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