- Packaging Development Engineer for MEMS products
- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.
- Develop and optimize assembly processes for MEMS in automotive and consumer-electronics acoustic applications.
- Oversee sample manufacturing and process qualification at assembly partners.
- Team work in English language with a multitude of international interfaces is mandatory.
Qualifications :
- 3-8 Years experience in packaging/assembly of semiconductors components especially familiar with LGA BGA DFN WLCSP SiP micro-phone
- Preferred solid technical background in assembly technology. Experience with acoustic device development is a plus.
- Passion for developing technical solutions in multidisciplinary international projects
- Experience in international corporation
- Excellent English skills (verbal and written); willingness to travel as required.
- Good teamwork with multitude of international interfaces
Remote Work :
No
Employment Type :
Full-time
Bosch first started in Vietnam with a representative office in 1994. Bosch has its main office in Ho Chi Minh City, with branch offices in Hanoi and Da Nang, and a Powertrain Solutions plant in the Dong Nai province to manufacture pushbelt for continuously variable transmissions (CVT) ... View more