Sr. Failure Analysis Engineer, SPICE Lab (Seattle)

Amazon

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profile Job Location:

Seattle, OR - USA

profile Yearly Salary: $ 128600 - 213600
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

SPICE lab (a Seattle-based branch of Amazons Lab126 subsidiary) is a research and development group partnering with Amazons most ambitious hardware organizations. SPICE lab supports Amazons growing portfolio of hardware programs including Prime Air Leo Mechatronics AWS Annapurna Lab126 Devices and others. If you are passionate about building the future and want to take part in developing ideas from concept to production consider joining the SPICE lab team!

The Role: The Failure Analysis team leverages science and engineering to improve product reliability and safety accelerate innovation and make a direct impact on design through high-quality analysis and expert interpretation of data. This position will support the Annapurna Labs organization by investigating failure mechanisms in enterprise compute and networking assemblies including thermal solutions. You will develop and execute world-class failure analysis outcomes utilizing electrical fault isolation techniques physical analysis spectroscopy and chemical characterization. A majority of time will be spent in a lab environment so demonstrated enthusiasm for hands-on work developing and executing lab procedures is key. You will act as the formal liaison between SPICE lab and the Annapurna Labs cross-functional teams coordinating failure analysis campaigns triaging devices from reliability qualifications and providing guidance on manufacturing and design best practices to drive reliability improvements at scale.

Key job responsibilities
Conduct failure analysis utilizing electrical fault isolation techniques physical analysis spectroscopy and chemical characterization.
Consultation on corrective actions method development design/manufacturing best practices cross-functionally to drive measurable improvements to hardware reliability.
Interface with Senior and Principal engineering staff to identify and execute lab method development spanning enterprise compute assemblies including power distribution compute networking and thermal management components.


A day in the life
You will split time between your desk in our office area and the lab facility down the hallway. Youll have a queue of failure analysis investigations at various stages tracked using our Issue Management application and provide Annapurna Labs stakeholders periodic updates on progress. Your projects will culminate in failure analysis reports which youll use to build consensus around corrective actions for the business to take. You will also undertake special projects to innovate on behalf of customers and expand the Product Integrity teams knowledge base developing new methodologies to drive materials selection design and operational improvements.

About the team
SPICE lab supports three main functions: Reliability Testing Failure Analysis and Materials Characterization. We frequently work together because conducting thorough root cause analysis is valuable for understanding and remedying any issues uncovered as part of a programs reliability testing plan. Likewise the reliability testing team can help to reproduce failure mechanisms helping to validate Failure Analysis teams hypotheses. Many of the same techniques are valuable in measuring materials properties or other figures of merit in materials selection exercises.

- Masters degree or above in mechanical engineering electrical engineering material science physics or equivalent
- Adept at electrical characterization techniques for electrical fault isolation (including curve trace DMM) and materials characterization (SEM/EDS FTIR XRF CT x-ray)
- Experience with enterprise compute thermal solutions. Examples include: 3D vapor chambers immersion/liquid cooling systems evaporative cooling infrastructure.

- Experience with thermal characterization techniques for NTD or fault isolcation such as lock-in thermography or OBIRCH
- Experience with developing and executing testing for thermal interface materials and/or heatsink devices.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.

Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $128600/year in our lowest geographic market up to $213600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge skills and experience. Amazon is a total compensation company. Dependent on the position offered equity sign-on payments and other forms of compensation may be provided as part of a total compensation package in addition to a full range of medical financial and/or other benefits. For more information please visit
This position will remain posted until filled. Applicants should apply via our internal or external career site.


Required Experience:

Senior IC

SPICE lab (a Seattle-based branch of Amazons Lab126 subsidiary) is a research and development group partnering with Amazons most ambitious hardware organizations. SPICE lab supports Amazons growing portfolio of hardware programs including Prime Air Leo Mechatronics AWS Annapurna Lab126 Devices and o...
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Key Skills

  • Catering
  • Apache Commons
  • Architectural Design
  • Human Resources Administration
  • Accident Investigation

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