Principal Engineer Mechanical

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Job Description:

As a Principal Mechanical Engineer you will be responsible for working through all phases of mechanical and thermal development for
Microchip HW solution cards. The designs will include plastic and metal parts heat sink assemblies product cases brackets and stiffeners
for PCIe U.2 and EDSFF form factor cards as well as customer custom mechanic requirements. You will also be required to design and
execute mechanical and thermal testing for production launch.
The products are cards based on Microchip developed ASICs and are primarily intended to be used in Storage Applications but can span
several vertical markets. A successful candidate will be a key player in the advancement of Microchips strategic product direction. The ideal
candidate must have excellent technical skills and excellent time management skills.

Requirements/Qualifications:

Principal Mechanical Engineer Roles and Responsibilities:
Experience in design of heat sinks and cases. Experience in design for storage applications is an advantage.
Collaborating with EE to design PCBAs
Shock and vibration simulation of PCBAs (ANSYS) CFD simulations of PCBAs (FLOTherm thermal management)
Create 3D CAD drawings (Solidworks). Generating PCBA 3D CAD from ECAD models designing on-board components
Design plastic and metal parts - Plastic and metal component holders heat sink assemblies brackets stiffeners.
DFM (design for manufacturing) - injection molding CNC stamping die-casting extrusion die-cutting.
Quick turn prototyping for fit form testing (3D printing CNC etc)
Identifying vendors working with vendors in ASIA for FAI DFM and trouble-shooting assembly manufacturing issues
Product testing develop SOPs for thermal shock and vibe testing both in-house and at external lab partners
Cross-functional collaboration across EE supply chain PMO testing customer ops
Data presentation to external customers
Perform basic EE functionality tests on PCBAs
Key interface between Program management and Operations team executing the mechanical parts for builds.
Support operations production failures.
Design test setup for thermal validation test
Collaboration with HW and operation team members to achieve optimal solution for thermal and cost considerations.
Required Qualifications:
Good technical skills.
Bachelors degree in Mechanical Engineering .
5 years industry related experience.
Excellent teamwork and time management skills.
Excellent verbal and written communication skills in English.
Deep knowledge and experience in heat sink and cases design for production.
Preferred Qualifications
5 years storage industry experience
Experience in thermal design and finding effective cooling solutions for small form factor solution cards.
Excellent oral/written communication interpersonal and analytical skills.
Outstanding organizational prioritization and multitasking skills.

Travel Time:

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