Lead Engineer (Pillar Lead) Package Development & Engineering
Share
Job Location:
Monthly Salary:
Posted on:
14 hours ago
Vacancies:
1 Vacancy
Job Summary
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Job Title: Pillar Lead Package Development & Engineering
Location: Singapore
GJS: E3E5
Department: Package Development & Engineering (PDE)
Role Summary
The PDE Pillar Lead will provide technical leadership and strategic oversight for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. This role is accountable for driving technology enablement yield acceleration and seamless integration of next-generation packaging solutions. The Pillar Lead will establish governance frameworks optimize development workflows and ensure alignment with PDEs charter to deliver cutting-edge packaging technologies.
Key Responsibilities
Technical Leadership & Program Execution
- Own the full lifecycle of PDE technology pillars including roadmap definition execution and closure.
- Define technical objectives key deliverables and resource allocation for pillar initiatives.
- Lead cross-functional engineering teams across TD HVM CPI DRAM and NPI to achieve aggressive technology milestones.
Governance & Operational Excellence
- Develop and enforce standardized methodologies for technical program management and pillar governance.
- Drive CapEx/OpEx planning PTM and MOR processes and integration of BOP design systems.
- Ensure compliance with internal governance models and customer technical requirements.
Strategic Alignment & Technical Communication
- Align pillar objectives with PDEs mission to embed analytics simulation and advanced modeling into development workflows.
- Facilitate technical communication across BU PDT TPM and central engineering teams.
- Provide leadership updates on technical progress risks and mitigation strategies.
Performance & Continuous Improvement
- Define and monitor KPIs for technology maturity yield performance and EOL accountability.
- Conduct technical reviews to validate outcomes and capture lessons learned.
- Mentor engineers and promote best practices for technical program management.
Qualifications
- Bachelors or Masters degree in Engineering Materials Science or related technical discipline.
- 8 years of experience in semiconductor packaging process integration or technology development.
- Proven ability to lead complex cross-functional technical programs in a high-tech environment.
- Deep understanding of advanced packaging flows including hybrid bonding CoWoS and chiplet integration.
- Strong technical communication and leadership skills.
Preferred Skills
- Familiarity with Microns PDE CPI and NPI frameworks.
- Expertise in simulation modeling yield enhancement and defectivity analysis.
About Micron Technology Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.
To learn more please visit qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin veteran or disability status.
To request assistance with the application process and/or for reasonable accommodationsplease contact
Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However all information provided must be accurate and reflect the candidates true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology Inc.
Required Experience:
IC
Key Skills
- Administrative Skills
- Facilities Management
- Biotechnology
- Creative Production
- Design And Estimation
- Architecture
About Company
Explore Micron Technology, leading in semiconductors with a broad range of performance-enhancing memory and storage solutions
