Job Description
Skills:
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Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders engineering drawings and IPC standards.
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Remove replace and re work components including bottom terminated devices (QFNs BGAs LGAs) using hot air pencils hot plates reflow ovens and specialty rework stations.
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Conduct X ray inspection of re worked bottom terminated parts evaluate solder joint integrity and document findings.
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Execute board level verification (visual AOI X ray) and functional testing to ensure conformance to specifications.
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Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply build to print practices where required.
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Minimum 5 years of hands on SMT/TH solder assembly in a high mix low volume environment (aerospace defense or similar).
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Additional certification (e.g. IPC A 610 IPC J STD 001)
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Ability to sit for extended periods and lift up to 25 lb (11 kg).
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Vision acuity (or corrective lenses) sufficient for detailed microscope work.
Job Description We are seeking a highly experienced Solder Assembler with deep expertise in both surface mount technology (SMT) and through hole soldering. The ideal candidate will be proficient in reworking and repairing a wide range of components-including bottom terminated devices such as QFNs ...
Job Description
Skills:
-
Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders engineering drawings and IPC standards.
-
Remove replace and re work components including bottom terminated devices (QFNs BGAs LGAs) using hot air pencils hot plates reflow ovens and specialty rework stations.
-
Conduct X ray inspection of re worked bottom terminated parts evaluate solder joint integrity and document findings.
-
Execute board level verification (visual AOI X ray) and functional testing to ensure conformance to specifications.
-
Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply build to print practices where required.
-
Minimum 5 years of hands on SMT/TH solder assembly in a high mix low volume environment (aerospace defense or similar).
-
Additional certification (e.g. IPC A 610 IPC J STD 001)
-
Ability to sit for extended periods and lift up to 25 lb (11 kg).
-
Vision acuity (or corrective lenses) sufficient for detailed microscope work.
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