Die Attach TD Module Engineer
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Job Location:
Monthly Salary:
Posted on:
2 days ago
Vacancies:
1 Vacancy
Job Summary
Job Details:
Job Description:
The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD in Asia initiative.
- The candidate will define and establish process flow procedures and equipment configuration for NPI products.
- Selects and develops material and equipment for the process to meet quality reliability cost yield productivity and manufacturability requirements.
- Plans and conducts experiments to fully characterize the process throughout the development cycle.
- Drives improvements on quality reliability cost yield process stability/proficiency productivity and safety/ergonomic over variables such as material method equipment environment and operating personnel.
- Develops solutions to problems utilizing formal education statistical knowledge and problem-solving tools.
- Establishes process control systems for the process module and sustains the module through volume ramp.
- Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future.
- Trains production/receiving process engineers for transfer to other virtual factories.
- Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.
A successful candidate should also exhibit the following behavioral traits:
- Problem-solving analytical troubleshooting willingness and communication skills.
Qualifications:
Minimum Qualifications:
- Bachelor Master or PhD degree in a relevant science engineering and technology fields (Physics Mechanical Chemical Electrical Electronic and Materials Engineering related field) with at least 3 years of relevant working experience or Master/PhD research project on relevant subject.
Preferred qualifications:
- Experience in Thermal Compression Bonding module
- Involvement in process development in assembly and packaging
- Led product direct startup/NPI
- Knowledge in statistical design of experiments to characterize process and problem-solving techniques
- Proficient in data analytics
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees medical examination fees or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process please report this immediately to our staffing team at
Job Type:
Experienced HireShift:
Shift 1 (Malaysia)Primary Location:
Malaysia KulimAdditional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era enabling our customers to design leadership products global manufacturing scale and supply chain through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers products receive our utmost focus in terms of service technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs develops manufactures and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:
All qualified applicants will receive consideration for employment without regard to race color religion religious creed sex national origin ancestry age physical or mental disability medical condition genetic information military and veteran status marital status pregnancy gender gender expression gender identity sexual orientation or any other characteristic protected by local law regulation or ordinance.Position of Trust
N/AWork Model for this Role
This role will require an on-site presence. * Job posting details (such as work model location or time type) are subject to change.Required Experience:
IC
Key Skills
- ASP.NET
- Health Education
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