Thermal & Mechanical Design Engineer Accelerator Boards

The Role:

We are seeking a Thermal & Mechanical Design Engineer to support the development of nextgeneration accelerator boards used in data center servers for HPC and AI/ML workloads. You will work closely with our senior thermal/mechanical architect to design analyze and validate cooling solutions and mechanical structures for highpower PCIe and custom formfactor accelerator cards.

This is an excellent opportunity for an engineer to get handson experience with cuttingedge data center hardware and learn from senior experts.

Key Responsibilities:

• Collaborate with the senior thermal/mechanical architect on thermal design of accelerator PCBs and assemblies including:
• Heat sink and cold plate design
• Air and liquid cooling solutions
• Thermal interface materials (TIMs) and heat spreaders
• Support CFD-based thermal simulations and analysis for highpower GPUs/accelerators VRMs and memory subsystems at the board and system level.
• Assist in mechanical design and packaging:
• 3D CAD models for heatsinks liquid cold plates coolant cirquits brackets backplates and retention mechanisms
• Compliance with server/PCIe mechanical constraints and standards
• Help define and execute thermal validation tests:
• Sensor placement and logging
• Chamber tests fan speed and airflow characterization
• Correlation of test results to simulation models
• Generate and maintain mechanical drawings BOMs and documentation in accordance with internal processes and data center standards.
• Work crossfunctionally with PCB SI/PI power and system teams to ensure thermal and mechanical requirements are incorporated early in the design.

Minimum Qualifications:

• Masters degree in Mechanical Engineering Aerospace Engineering or related field.
• 5 years of relevant experience in thermal and/or mechanical design (internships and project experience acceptable).
• Basic understanding of:
• Heat transfer and fluid dynamics (conduction convection radiation)
• Mechanical design principles and tolerance/stack-up
• Experience with 3D CAD tools (e.g. Creo SolidWorks NX or similar).
• Exposure to thermal simulation tools (e.g. FloTHERM Icepak 6SigmaET Creo Flow Analysis or similar) even at university or project level.
• Strong problemsolving skills attention to detail and willingness to learn in a fastpaced environment.

Preferred Qualifications:

• Experience involving electronics cooling or data center/server hardware.
• Familiarity with industry standards such as PCIe card form factors 19 rack systems or OCP server designs.
• Handson lab experience with thermal measurement (thermocouples IR cameras etc.).
• Basic scripting skills (Python/Matlab) for data processing and report generation.

What We Offer

• A chance to work on one of the most transformative AI and silicon engineering companies in Europe with cutting-edge technology and industry leaders.
• We offer a remuneration package that values your experience.
• We believe in investing in our employees and providing them with opportunities for growth and career development.
• Work in a hybrid environment with flexible scheduling.
• Join an innovative team and experience company growth.
• Opportunity to travel to other countries in Europe to meet the teams collaborate and drive solutions.
• Place of work: Karlsruhe (Germany)

We are looking for outstanding people willing to join our mission to change the silicon industry and help build a better world. If you identify with Openchip please contact us.

At Openchip & Software Technologies S.L. we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued respected and empowered to reach their full potentialregardless of race gender ethnicity sexual orientation or gender identity.