Define & drive milestones: Establish major packagedevelopment milestones and ensure on-time delivery through proactive planning progress tracking and risk mitigation.
Design coordination: Coordinate package design and process development for inertial MEMS devices in collaboration with internal engineering teams and external suppliers.
Process engineering: Develop and optimize assembly processes for inertial MEMS in automotive and consumer-electronics applications.
Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.
Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering supply chain and quality teams.
Qualifications :
Experience: 38 years in semiconductor packaging/assembly (LGA BGA DFN WLCSP SiP).
Technical expertise: Strong background in semiconductor assembly technologies and materials. Experience in TSV processes and WLSCP device development is a plus.
Project management: Proven ability in milestone tracking structured reporting systematic problem solving multi-task handling persistence and customer communication.
Global teamwork: Demonstrated success in multicultural international projects.
Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.
Language & mobility: Excellent English skills (verbal and written). Precise and target group oriented communication. Willingness to travel as required.
Remote Work :
No
Employment Type :
Full-time
Bosch first started in Vietnam with a representative office in 1994. Bosch has its main office in Ho Chi Minh City, with branch offices in Hanoi and Da Nang, and a Powertrain Solutions plant in the Dong Nai province to manufacture pushbelt for continuously variable transmissions (CVT) ... View more