Silicon Packaging Architect

Intel

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profile Job Location:

Bengaluru - India

profile Monthly Salary: Not Disclosed
Posted on: 11 hours ago
Vacancies: 1 Vacancy

Job Summary

Job Details:

Job Description:

  • Translates product requirements into package architecture specification drives end-to-end package solutions for physical electrical and cost requirements.
  • Leads technology tradeoff decisions ensuring silicon packages conform to electrical mechanical thermal and reliability standards specifications and landing zones.
  • Collaborates with silicon hardware and package leads to ensure high quality package output and aids in removing roadblocks.
  • Oversees end-to-end package development process including design processes and procedures and continuously improves packaging quality standards and targets.
  • Applies expertise in package design troubleshooting resolves new and existing packaging problems involving designs materials and processes and provides innovative and cost-effective solutions.
  • Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications:

  • Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
  • Prior leadership role in package technology readiness development design tape-out and/or innovation.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees medical examination fees or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process please report this immediately to our staffing team at.

Job Type:

Experienced Hire

Shift:

Shift 1 (India)

Primary Location:

India Bangalore

Additional Locations:

Malaysia Penang

Business group:

Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society and for every person on Earth. Harnessing the capability of the cloud the ubiquity of the Internet of Things the latest advances in memory and programmable solutions and the promise of always-on 5G connectivity Intel is disrupting industries and solving global challenges. Leading on policy diversity inclusion education and sustainability we create value for our stockholders customers and society.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race color religion religious creed sex national origin ancestry age physical or mental disability medical condition genetic information military and veteran status marital status pregnancy gender gender expression gender identity sexual orientation or any other characteristic protected by local law regulation or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model location or time type) are subject to change.
Job Details:Job Description:Translates product requirements into package architecture specification drives end-to-end package solutions for physical electrical and cost requirements.Leads technology tradeoff decisions ensuring silicon packages conform to electrical mechanical thermal and reliability...
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