Advanced Technology Japan Engineer, WoW Bonding

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

職務概要
ATEAdvanced Technology Engineering部門におけるWafer Bondingプロセスエンジニアとして次世代技術の導入立ち上げ最適化を担当します最新鋭装置評価プロセス開発及び改善歩留まり向上コスト削減生産性改善に関する活動を推進しRnD他サイト各種Supplierなどのグローバルチームと連携して技術課題を解決します
本ポジションではDOE/SPC/FMEAなどの手法を用いてプロセスの信頼性を確保し品質コストリスク管理の目標達成に貢献します

As a Wafer Bonding Process Engineer in ATE (Advanced Technology Engineering) department you will be responsible for introducing ramping up and optimizing next-generation technologies. Your role includes evaluating state-of-the-art equipment developing and improving processes driving yield enhancement cost reduction and productivity improvement initiatives. You will collaborate with global teams such as R&D other sites and various suppliers to resolve technical challenges.
In this position you will utilize methodologies such as DOE SPC and FMEA to ensure process reliability and contribute to achieving goals in quality cost and risk management.

職務内容

• Wafer Bondingプロセスの開発最適化
• Wafer BondingSi GrindingBevel Trimmingの統合最適化
• 装置評価導入アップグレード
• 新規装置のセットアップ性能評価プロセス安定化
• 装置メーカーとの技術協議仕様改善提案
• 品質歩留まり改善活動
• SPCメトリクス導入異常解析再発防止策策定
• FMEA8D問題解決手法によるリスク低減
• 技術開発プロジェクトの推進
• 次世代技術の量産移行に向けたプロセス開発
• グローバルチームとの共同研究標準化活動
• 材料サプライヤーとの連携による品質コストリスク管理

Job Responsibilities

• Development and Optimization of Wafer Bonding Processes
• Integrated Optimization of Wafer Bonding Si Grinding and Bevel Trimming
• Equipment Evaluation Installation and Upgrades
• Set up new equipment perform performance evaluations and stabilize processes
• Conduct technical discussions with equipment vendors and propose specification improvements
• Quality and Yield Improvement Activities
• Implement SPC metrics perform abnormality analysis and establish preventive measures
• Reduce risks using FMEA and 8D problem-solving methodologies
• Driving Technology Development Projects
• Develop processes for transitioning next-generation technologies to mass production
• Collaborate with global teams on joint research and standardization activities
• Coordinate with Material Suppliers for Quality Cost and Risk Management
  

応募要件
必須スキル経験

• Wafer BondingSi GrindingBevel Trimmingの実務経験
• 半導体パッケージ技術に関する深い知識
• DOESPCFMEAなどの品質改善手法の実務経験
• 英語での技術コミュニケーション能力グローバルチーム対応
• Microsoft OfficeExcelWordPowerPoint

歓迎スキル

• CMPや3D集積技術の経験
• LabVIEWFPGA制御Python/Matlabによるデータ解析自動化スキル
• プロジェクトリード経験標準化活動への参画経験
• 日本語でのコミュニケーション能力

Required Skills and Experience

• Practical experience in Wafer Bonding Si Grinding and Bevel Trimming
• In-depth knowledge of semiconductor packaging technologies
• Hands-on experience with quality improvement methodologies such as DOE SPC and FMEA
• Ability to communicate technical information effectively in English (for collaboration with global teams)
• Proficiency in Microsoft Office (Excel Word PowerPoint)

Preferred Skills

• Experience with CMP and 3D integration technologies
• Skills in data analysis and automation using LabVIEW FPGA control Python or MATLAB
• Experience in project leadership and participation in standardization activities
• Japanese language proficiency at a conversational level.

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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