IC Packaging Simulation Engineer
Share
Job Location:
Santa Clara County, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
In this role you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. You will also be working on scripting CAD/FEM software and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
- BS and 3 years of relevant industry experience.
- Proven capability in mechanics and mathematics.
- Hands-on experience of major FEM tools (e.g. ANSYS ABAQUS Hypermesh etc.).
- Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python.
- Hands-on experience of Gen-AI and Machine Learning.
- Deep understanding of packaging materials and their mechanical behaviors.
- Knowledge of electronic packaging structures and processes as well as its reliability and package qualification requirements is a huge plus.
- Able to perform independent research and development work.
- Excellent written and verbal communication skills with ability to present ideas design concepts data and plan with high confidence at team meetings.
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more
