Junior Signal and Power integrity Engineer
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Job Location:
Monthly Salary:
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Department:
Job Summary
AWS Utility Computing (UC) provides product innovations from foundational services such as Amazons Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2) to consistently released new product innovations that continue to set AWSs services and features apart in the industry. As a member of the UC organization youll support the development and management of Compute Database Storage Internet of Things (Iot) Platform and Productivity Apps services in AWS. Within AWS UC Amazon Dedicated Cloud (ADC) roles engage with AWS customers who require specialized security solutions for their cloud services.
The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die the package layout design of the BGAs substrate Signal and power integrity simulations and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates or engineers with up to 3 years experience in related fields to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain
Key job responsibilities
As a SIP engineer you will be involved in:
Work on advanced high-speed interfaces such as PCIe DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level through Package and PCB routing addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.
Hands-on lab work involving oscilloscopes spectrum analyzers and other RF/mixed-signal measurement equipment for advanced electrical characterization.
You will undergo a comprehensive training program providing you with the essential knowledge and skills required to succeed in this field. The work is multidisciplinary bridging physical design electromagnetic theory and practical engineering challenges.
- BSc in Electrical Engineering or Electrical Engineering and Physics. Make sure to include a grade sheet with your CV in a single PDF.
- Strong foundations in physics and electromagnetics.
- Communication Electromagnetics Signal processing Microelectronics.
- Previous experience with lab equipment (e.g oscilloscope spectrum analyzer) is a strong advantage.
- Familiarity with simulation/extraction tools (e.g. HFSS Sigrity HSpice) - an advantage.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die the package layout design of the BGAs substrate Signal and power integrity simulations and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates or engineers with up to 3 years experience in related fields to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain
Key job responsibilities
As a SIP engineer you will be involved in:
Work on advanced high-speed interfaces such as PCIe DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level through Package and PCB routing addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.
Hands-on lab work involving oscilloscopes spectrum analyzers and other RF/mixed-signal measurement equipment for advanced electrical characterization.
You will undergo a comprehensive training program providing you with the essential knowledge and skills required to succeed in this field. The work is multidisciplinary bridging physical design electromagnetic theory and practical engineering challenges.
- BSc in Electrical Engineering or Electrical Engineering and Physics. Make sure to include a grade sheet with your CV in a single PDF.
- Strong foundations in physics and electromagnetics.
- Communication Electromagnetics Signal processing Microelectronics.
- Previous experience with lab equipment (e.g oscilloscope spectrum analyzer) is a strong advantage.
- Familiarity with simulation/extraction tools (e.g. HFSS Sigrity HSpice) - an advantage.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Required Experience:
Junior IC
Key Skills
- IDS
- System Design
- Haskell
- PCB
- Root cause Analysis
- Technical Writing
- System Security
- Federal Aviation Regulations
- Warehouse Distribution Experience
- Encryption
- Product Development
- Contracts
About Company
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