Semiconductor Advanced Packaging Engineer Irvine, California
Share
Job Location:
Irvine, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
OPEN JOB: Principal Application Engineer - Semiconductor Advanced Package
LOCATION:Irvine California
***Relocation Assistance Available
SALARY: $120000 to $150000
INDUSTRY:Manufacturing & Production
JOB CATEGORY:Engineering - Industrial / Manufacturing
This position is with our Adhesive Technologies business unit where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives sealants and functional coatings.
What youll do
What makes you a good fit
If you are interested in pursuing this opportunity please respond back and include the following:
JASON DENMARK
Recruiting Manager
INTERMEDIA GROUP INC.
EMAIL:
LINKEDIN:
LOCATION:Irvine California
***Relocation Assistance Available
SALARY: $120000 to $150000
INDUSTRY:Manufacturing & Production
JOB CATEGORY:Engineering - Industrial / Manufacturing
This position is with our Adhesive Technologies business unit where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives sealants and functional coatings.
What youll do
- Technical service engineer who provides technical engineering support for the companys Advanced Packaging Material products and responsible for developing in depth application knowledge for the companys Electronics markets.
- Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes and direct interaction with customers to troubleshoot and solve product and process related problems.
- She/he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
- Solves technology-specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development troubleshooting and material characterization.
What makes you a good fit
- Minimum of a bachelors degree in Material Science/Engineering Mechanical Engineering Chemical Engineering or other related fields with 10 years of experience working in a chemical for semiconductor advanced packaging environment.
- ***Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package
- Expertise in wafer level encapsulation and molding process in semiconductor package
- Have strong verbal communication skills one-on-one with colleagues/customers as well as in front of groups with solid interpersonal skills with ability to work as a team member and independently on multi-task assignments
- Strong ownership and responsibility with customer-oriented mindset and good understanding of customer request & culture
- Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently
- Traveling of up to 10% will be part of this role.
If you are interested in pursuing this opportunity please respond back and include the following:
- Full MS WORD Resume
- Required compensation
- Contact information
- Availability
JASON DENMARK
Recruiting Manager
INTERMEDIA GROUP INC.
EMAIL:
LINKEDIN:
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
your search ends here innovative staffing solutions for job seekers as well as corporate and government clients nationwide for over 20 years View All Our Openings About Us Intermedia Group, founded in 1996, provides expert staffing services for our clients’ full time salaried employee ... View more
