Provide comprehensive Failure Analysis during development NPI process. Perform hands-on FA work using advanced FA tools and methodologies to uncover failure mechanisms. Work with various functional teams for root cause identification simulation and solutions.
Degree/Master holder in Materials/Chemistry/Electrical Engineering
Possess a strong command of failure analysis methods and in any of the corresponding field experience: 3 years experience in electrical fault isolation OR 3 years experience in physical FA using X-ray/SEM/FIB/X-sect OR Experience in surface morphology tools
Knowledge of IC assembly packaging design process and testing
Passionate in photography keen in camera technology
Ability to work independently yet also be a strong team-player who thrives in dynamic and ever-changing work environments.
Strong solution-focused work ethic with a high degree of flexibility supporting multiple projects of varying complexity and priority.
Self-motivated with strong written and verbal communications skills
Auger experience is a plus
Nano-indenter experience is a plus
Process FA experience in semiconductors or optical devices is a plus
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