Embedded Design Engineering Intern

Leidos Defense Systems is seeking a talentedEmbedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. We have offices across the United States that provide responsive cost-effective engineering scientific and IT solutions in the defense space cyber and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.

At Leidos our mission is to reach equip and teach students with an interest in the field of defense and aerospace. Running for over two decades the internship program has been a staple at Leidos giving interns hands-on experience in their future career path. With no shortage of work available interning with Leidos promises growth experience and unrivaled opportunity across the US.

This position is anEmbedded Design Engineering Intern in the Electrical Systems Department. The selected candidate will have an opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing integration testing and post-delivery support. The engineer student may be responsible for implementing and testing embedded hardware and firmware on a variety of platforms including FPGAs microcontrollers microprocessors and mixed signal designs. Additional learning opportunities related to digital-signal processing (DSP) design printed circuit board (PCB) design experience with technical trade studies and evaluation of technology improvements will be provided to the engineering student through this internship.

The intern working in this area will develop significant experience in the following areas:

• C C VHDL Verilog assembly
• Communication protocols such as: UART Ethernet SPI I2CCAN bus etc.
• Hands-on laboratory experience with instrumentation test equipment and debug/test methods
• Perform in a collaborative engineering environment working closely with multi-disciplinary teams
• Xilinx FPGA and SoC families and design tools(RFSoC Xilinx IP Cores AXI4 AXI-Stream)
• RISC microprocessors architectures (ARM Cortex Microblaze PowerPC RISC-V)
• Memory architectures typesand caching
• GNU/Linux and developing kernel drivers
• Embedded operating systems (Linux VxWorks Integrity FreeRTOS uC/OS-II)

Basic Qualification

• Candidate must be currently enrolled in an accredited college / university and currently working towards a Bachelors Masters or PhD in Computer Engineering or a related field.
• Candidate must have a GPA of 3.0 or higher.
• Candidate must upload a resume and unofficial transcripts along with application.
• Must be a US Citizen

At Leidos we dont want someone who fits the moldwe want someone who melts it down and builds something better. This is a role for the restless the over-caffeinated the ones who ask whats next before the dust settles on whats now.

If youre already scheming step 20 while everyone else is still debating step 2 good. Youll fit right in.

Original Posting:

Pay Range:

The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job education experience knowledge skills and abilities as well as internal equity alignment with market data applicable bargaining agreement (if any) or other law.