Advanced Packaging Process Integration Principal Staff Engineer

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

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As a Process Integration Principal/ Staff Engineer be part of an exciting research and development team to work on cutting-edge Advanced Packaging process this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile IoT Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis risk-assessment and mitigation and integration process flow development to make sure projects are completed successfully and delivered on time.

Responsibilities:

• Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer Through-Silicon Via Backside Via Reveal Hybrid Bonding

• Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.

• Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield reliability.

• Collect on-wafer data perform data analysis and provide outcome learnings and plan for the next process steps.

• Owns manage and drive technical programs/ project report out timely status and interface with various stakeholders/management leading to completion.

Experience:

• At least 7 years of hands-on experience deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.

• Knowledge of Advanced Packaging architecture and process flow such as flip-chip Through-Silicon Via Re-Distribution Layer Singulation Hybrid Bonding assemblies reconstitution etc will be advantageous.

• Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution Litho Etch CVD PVD Plating Back Grinding Dicing Molding P&P Wire Bonding etc.) will be advantageous.

• Good understanding on enabling high-density interconnects associated mechanical thermal and reliability issues and cost tradeoffs of various interposers process technologies.

• Demonstrate ability and experience to work solve complex problems and drive projects to end goals completions.

• Demonstrate ability experience and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.

• Bachelor Master Doctorate in STEM disciplines e.g. Physics Chemistry Electrical Mechanical or Materials Science Engineering.

Work Location:

• Science Park II

Additional Information

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Relocation Eligible:

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.