MTS Advanced Packaging Equipment Engineer
MTS Advanced Packaging Equipment Engineer
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Job Description
About GlobalFoundries
GlobalFoundriesis a leading full-service semiconductor foundry providing a unique combination of design development and fabrication services to some of the worlds most inspired technology companies. With a global manufacturing footprint spanning three continents GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information visit.
Introduction:
Giga Fab is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center Singapore.
The CMP Equipment Engineer position reports directly to a functional area module manager in Giga Fab in Singapore. The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related backgrind and plating process (backgrind and TSV fill) do troubleshooting for process and tool issues. Additionally the candidate will be expected to assist in tooling start-up installing the processes into manufacturing and owning the processes and the tools in manufacturing.
Job Responsibilities:
Designing executing and analyzing experiments to develop advanced packaging backgrind and plating processes to meet technology (e.g. performance yield and reliability) and manufacturing (e.g. process stability cost of ownership) targets.
Tool setup qualification and tool matching.
Improve process robustness for high volume manufacturing using statistical tools DOE techniques data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
To work closely with equipment team to improve equipment productivity indices
Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.
Sustain and improve process / SPC to meet quality cost productivity requirements
To coach and develop other engineers on advance packaging backgrind and plating processes knowledge.
Perform all activities in a safe and responsible manner and support all Environmental Health Safety & Security requirements and programs
Related manufacturing and development experience is requested.
Required Qualifications:
BS degreein Electrical Engineering Chemical Engineering Science Solid State Physics or other relevant engineering physical science discipline is required
Relevant working experience in backgrind (DISCO) and TSV fill plating (LAM) process or equipment.
Preferred Qualifications:
Masters Degree or PhD in Chemistry Electrical Engineering Materials Science Solid State Physics or other relevant engineering physical science discipline is required
Excellent verbal and written communication skills.
Strong interpersonal skills and ability to work effectively with different cultures.
GlobalFoundries is an equal opportunity employer cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity efficiency and innovation whilst our employees feel truly respected valued and heard.
As an affirmative employer all qualified applicants are considered for employment regardless of age ethnicity marital status citizenship race religion political affiliation gender sexual orientation and medical and/or physical abilities.
All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks medical screenings as applicable and subject to the respective local laws and regulations.
Employment Type
Full-Time
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