Technical Program Manager (TPM), Image Sensor, Japan
Technical Program Manager (TPM), Image Sensor, Japan
Posted on :
23-08-2025
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1 Vacancy
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Job Description
On site Technical Operations owner for Mass production readiness of NPI Ramp and Sustaining areas of assigned image sensor products Approve vendor process flow process quality control plan (tests methods sample sizes pass /fail criteria) equipment list and Cosmetic specs (Ensure cosmetic standards are aligned with Module integrators) for production readiness Contribute to mass production release reviews and verify that all are ready to ramp In mass production lead resolution of device related quality issues in wafer fab back-end processing transit and module integrator Set a vision for constant product quality and operational improvement year over year. Set daring targets and drive plans to achieve Be involved at product concept to ensure products are designed for manufacturing (DFM) Build in constant design improvement for product quality factory efficiency and product cost Manage new process introduction and special projects such as new testers Ensure device vendors are conforming to Apple specs and requirements Conduct site quality and process audits Ensure timely test correlation activities and close test gaps between device module and system Monitor yield and manufacturing metrics (CpK FMEA etc.). Drive yield improvement as appropriate Drive FACA for sensor related returns from integrators field returns and EFFA issues. Track report and close out issues in a timely manner Ensure 8D reports and PCNs are maintained accurately Raise and balance formal company-wide Quality Alerts Organize three-way meetings with device vendors and module integrators to get feedback on downstream issues and to ensure smooth co-working. Assist and arbitrate as needed Manage the quality relationship with image sensor vendors. This involves regular face to face reviews efficient vendor reporting systems and audits Ensure qualification and reliability activities at vendors are in line with requirements Regularly provide status reporting updates to executives and escalation when needed Teamwork: constant interfacing with multiple functional teams across Apple including Supplier quality engineeres at module integrators device design team reliability engineers and system quality engineers
- BS/MS in Electrical Engineering Material Engineering Semiconductor devices or allied technical subject.
- 5 Years experience in semiconductor device manufacturing fields (Process engineering Process integration engineering)
- Flexibility for within-Japan travel (30%) International Travel (< 5%)
- Working proficiency of the English and Japanese language
- Interpersonal skills of leadership project management communication collaboration influencing and negotiation
- Technical understanding of wafer fab process integration wafer test wafer packaging back-end issues
- Familiarity with wafer fab quality systems and quality control
- Solid understanding of image sensor technology performance metrics sensor usage test and integration into module and camera system is preferred
- Experience with external vendor supplier or foundry management
- Evening and weekends work will be needed
Required Experience:
Manager
Employment Type
Full Time
Key Skills
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