Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Microns vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a transformative period in artificial intelligence (AI) where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Microns Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Equipment Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and optimizing next generation first of a kind (FOAK) wafer and die Equipment for advanced packaging technologies to meet performance cost manufacturability quality reliability and schedule requirements. You will also be required to identify diagnose and resolve equipment related problems. Additional responsibilities include coordinating and carrying out equipment evaluation to implement changes leading and participating in equipment maturity and cost reduction activities.

Key responsibilities and duties include:

Equipment Development:

• Develop and optimize advanced packaging equipment for technology enablement including wafer-level packaging and stacking

• Focus on improving equipment capability enabling process improvements reducing costs and enhancing productivity

• Establish and improve equipment management projects to deliver technode requirements

Equipment Strategy:

• Evaluate and promote new equipment and materials to enhance process capabilities

• Establish hardware strategic roadmaps for 5 years in post probe wafer and die processing

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Microns products. cost availability and improve hardware and process capability

Quality Improvement:

• Ensure defense coverage through process measurement inspection and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams including the Package Integration PWF/Assembly Engineering Front End Wafer Fab Assembly/Test Engineering Product Engineering and Global Quality to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development qualification small volume production to high volume production

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering Materials Science Chemical Engineering Electrical Engineering Physics or other related technical fields

• 2 or more years of semiconductor process or equipment engineering experience preferably in wafer bonding plating warpage control and packaging field

• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware

• Tenacity to work effectively under timelines and limited resources

• Consistent track record to solve problems and address root causes

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

To learn more please visit qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin veteran or disability status.

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Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.