Staff/Senior Engineer - Chip Packaging
Staff/Senior Engineer - Chip Packaging
Posted on :
22-08-2025
Employer Active
1 Vacancy
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Job Description
Staff/Senior Engineer Chip Packaging
Responsibilities:
Requirements:
We invite you to write in to Kevin at with your updated CV (in MSWord format). We regret to inform only selected candidates will be notified. However if you are not selected we will keep your CV and contact you for suitable role(s) that comes along.
Kevin Chong
WA: 65-
EA Reg No. R1109670
EA License No. 22S1412
Responsibilities:
- Responsible for packaging solutions and design defining performance criteria for signal integrity (SI) power integrity (PI) and thermal performance.
- Optimize power performance in packaging design focusing on PI and SI parameters.
- Manage collaboration and technical communication with packaging and testing vendors.
Requirements:
- Bachelors degree or higher in Electronic Engineering Microelectronics Computer Science or a related field.
- Minimum of 5 years of experience in packaging design and development or experience in project development at a design company.
- Strong communication and coordination skills teamwork spirit and resilience under pressure.
- Proficiency in both written and spoken English and Chinese is a plus.
We invite you to write in to Kevin at with your updated CV (in MSWord format). We regret to inform only selected candidates will be notified. However if you are not selected we will keep your CV and contact you for suitable role(s) that comes along.
Kevin Chong
WA: 65-
EA Reg No. R1109670
EA License No. 22S1412
Required Experience:
Senior IC
Employment Type
Full-Time
Key Skills
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