Principal Process Engineer, APTD Bonding

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D equipment and materials suppliers and manufacturing teams we ensure the efficient development transfer and implementation of new technology nodes maintaining Microns leadership in the industry.

Position Overview:

As a Principal Process Engineer in Advanced Packaging you will be primarily responsible for starting up developing and optimizing processes to improve product quality and reliability working on process yield improvement cost reduction productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify diagnose and resolve assembly process related problems by applying failure analysis FMEA 8D or SPC/FDC methodology.

Responsibilities:

• Identify diagnose and resolve assembly process related problems

• Coordinate and complete process equipment and material evaluation / optimization initiatives and make changes at process step

• Lead / participate in continuous yield improvement and cost reduction activities

• Validate and fan out new process baseline qualified including new process tools and/or materials for new product introduction

• Support SPC/FDC/RMS/APC

• Support site to site portability

• Lead audit material suppliers to achieve quality cost and risk management objectives

• Support internal and external audits

Minimum Qualifications:

• Bachelors or Masters degree in Electrical Mechanical Computer Engineering Chemistry Physics Materials or related field or equivalent experience

• 8 years of validated experience in Process Integration/Development or Package Integration within the semiconductor industry

• Strong architectural sense to translate process/design into technical requirements and specifications

• 10 years expertise in data extraction analysis and reporting tools such as JMP Python R

• In-depth understanding of process flows interactions and their effects on yield performance and reliability

• Technical knowledge and hands-on experience in die-to-wafer and wafer-to-wafer bonding processes and equipment is a must.

• Experience in various assembly processes like Dicing Thinning Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures

Preferred Qualifications:

• Masters or PhD in Materials Science Chemistry Physics Mechanical or Metallurgical Engineering

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

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