Lead new equipment and process development for electrical/optical modules. Convert incubation technologies and proof-of-concept equipment and process into scalable and executable solutions and validate them through module process optimizations and closely and collaboratively with cross-functional team members internal labs and external vendors to define design modify test and qualify equipment hardware and softwareBe responsible for DOE planning empirical trials theoretical analysis characterization data analysis and visualization parameter optimization documentation sharing and reporting results. Lead communication with cross-functional team and executives in a timely fashion. Keep tabs on relevant industrial equipment and process manufacturing technology trends. Evaluate and assess new EQ suppliersAbout 10-20% international travel to work with vendors in factories
B.S. degree in opto-mechanics mechatronics robotics or mechanical engineering or related with minimum of 3 years of direct experience in process and equipment development for electrical or optical products.
Experience in process fundamentals including electrical interconnect (soldering SMT TCB) laser bonding(LAB) flip-chip bonding advanced semiconductor packaging PnP precision alignment and assembly etc.
Experience in designing building and operating high-precision bonding/assembly equipment or laser equipment.
Experience in equipment automation cycle time optimization and line balancing efficiency projection and validation in-process quality control with metrology and testing.
Experience 3D CAD (e.g. NX Solidworks) control systems and software interface (e.g. Labview Python) mechatronics and robotics and data analysis tools (e.g. Matlab JMP).
Ph.D. degree in relevant field.
Broad knowledge in interconnect and laser bonding.
Experience in equipment design
Strong record in process or equipment innovations for mass production products.
Willing to work in a fast paced project with dynamic changes of project priority and technical directions.
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