Silicon Photonics Design & Packaging Engineer
Silicon Photonics Design & Packaging Engineer
Posted on :
02-08-2025
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1 Vacancy
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Monthly Salary
USD 181100 - 318400
Vacancy
1 Vacancy
Posted on :
02-08-2025
Job Description
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
- BS and 10 years of experience in relevant industry experience
- M.S or Ph.D. in Physic (Optics major) Electrical Engineering Materials Science Mechanical Engineering or an equivalent field desired preferred.
- Excellent teamwork and communication skills.
- Strong theoretical background in optics and photonics fundamentals device/module integration
- Hands-on experience in photonic IC (PIC) design silicon photonics device laser high speed modulator PD passive components such as Si WG MUX/DeMUX.
- Hands-on experience in Si photonics packaging and measuring fiber-coupled devices.
- Hands-on experience in optical component design simulation and qualification and single / multi-mode fiber assembly using active and passive alignment tool. Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC CoW WLP)
Employment Type
Full Time
Key Skills
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