Senior Advanced Materials Engineer - Phoenix, AZ
Senior Advanced Materials Engineer - Phoenix, AZ
Posted on :
01-08-2025
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1 Vacancy
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Job Description
ATTENTION MILITARY AFFILIATED JOB SEEKERS- Our organization works with partner companies to source qualified talent for their open roles. The following position is available toVeterans Transitioning Military National Guard and Reserve Members Military Spouses Wounded Warriors and their Caregivers. If you have the required skill set education requirements and experience please click the submit button and follow the next steps. Unless specifically stated otherwise this role is On-Site at the location detailed in the job post.
Job Description
Honeywell Aerospace Materials Engineering (MatEng) is seeking an experienced materials and process engineer with expertise in printed circuit boards. This position is at the Sr Advanced level and will be based at the Deer Valley site in Phoenix AZ.
The successful candidate will be expected to have an immediate impact as a printed circuit board technical leader and expert. This includes problem solving project leadership specification reviews and supplier audits for all aspects of printed circuit board manufacturing and design including for rigid flex rigid-flex high density and RF boards across all Aerospace sites and suppliers. The successful candidate will be expected to have knowledge of and experience of the latest industry standards for printed circuit boards.
Key Responsibilities
Ability to provide technical leadership and expertise to solve material and process problems for both design and manufacturing of printed circuit boards.
Ability to provide technical expertise to support Aero special process teams (in particular the electronics team) and team activities including supplier technical process audits and technical problem solving.
Ability to deploy technical expertise in generation review and maintenance of site Aero and industry specifications.
Ability to perform failure analysis determine root cause and appropriate corrective actions and implement corrective actions.
Ability to apply six sigma tools in the failure analysis process including development and implementation of design of experiments (DOEs).
Ability to perform trade studies to evaluate suitability reliability and failure characteristics of materials and assemblies.
Ability to provide technical support and leadership of special projects related to materials obsolescence product / process improvement technology development etc.
Ability to function as the primary technical interface for materials and process-related issues for specific programs and the ability to engage other technical materials and process experts for problem solving where assistance may be needed.
Ability to provide direct support to program design activity including material and process selection completing customer deliverables (i.e. material and process analysis and test reports) and technical problem-solving during development qualification and production phases.
Ability to provide program / customer interface and communications to assure clarity and confidence for all projects actions and deliverables.
Job Description
Honeywell Aerospace Materials Engineering (MatEng) is seeking an experienced materials and process engineer with expertise in printed circuit boards. This position is at the Sr Advanced level and will be based at the Deer Valley site in Phoenix AZ.
The successful candidate will be expected to have an immediate impact as a printed circuit board technical leader and expert. This includes problem solving project leadership specification reviews and supplier audits for all aspects of printed circuit board manufacturing and design including for rigid flex rigid-flex high density and RF boards across all Aerospace sites and suppliers. The successful candidate will be expected to have knowledge of and experience of the latest industry standards for printed circuit boards.
Key Responsibilities
Ability to provide technical leadership and expertise to solve material and process problems for both design and manufacturing of printed circuit boards.
Ability to provide technical expertise to support Aero special process teams (in particular the electronics team) and team activities including supplier technical process audits and technical problem solving.
Ability to deploy technical expertise in generation review and maintenance of site Aero and industry specifications.
Ability to perform failure analysis determine root cause and appropriate corrective actions and implement corrective actions.
Ability to apply six sigma tools in the failure analysis process including development and implementation of design of experiments (DOEs).
Ability to perform trade studies to evaluate suitability reliability and failure characteristics of materials and assemblies.
Ability to provide technical support and leadership of special projects related to materials obsolescence product / process improvement technology development etc.
Ability to function as the primary technical interface for materials and process-related issues for specific programs and the ability to engage other technical materials and process experts for problem solving where assistance may be needed.
Ability to provide direct support to program design activity including material and process selection completing customer deliverables (i.e. material and process analysis and test reports) and technical problem-solving during development qualification and production phases.
Ability to provide program / customer interface and communications to assure clarity and confidence for all projects actions and deliverables.
Additional Qualifications/Responsibilities
YOU MUST HAVE
Bachelors Degree in Engineering Applied Science or Science.
Minimum 8 years of direct experience with printed circuit board manufacturing processes (e.g. material control inner layer processes lamination copper plating solder mask final finish micro-section evaluation etc.).
WE VALUE
Direct experience working in Materials and Process engineering design and applications roles supporting aerospace hardware.
Direct experience with industry military and aerospace specifications.
Direct experience with at least one other process used in electronic box manufacturing (e.g. soldering cleaning conformal coating printed board assembly cable/wire harness assembly box assembly processes etc.).
Direct experience in auditing systems processes and procedures.
Direct experience in project leadership and achieving results through use of influence negotiation and persuasion.
Ability to utilize continuous improvement tools processes and methodologies including RCCA
In addition to a competitive salary leading-edge work and developing solutions side-by-side with dedicated experts in their fields Honeywell employees are eligible for a comprehensive benefits package. This package includes employer subsidized Medical Dental Vision and Life Insurance; Short-Term and Long-Term Disability; 401(k) match Flexible Spending Accounts Health Savings Accounts EAP and Educational Assistance; Parental Leave Paid Time Off (for vacation personal business sick time and parental leave) and 12 Paid Holidays .For more Honeywell Benefits information visit: application period for the job is estimated to be 40 days from the job posting date; however this may be shortened or extended depending on business needs and the availability of qualified candidates.
Due to compliance with U.S. export control laws and regulations candidate must be a U.S. Person which is defined as a U.S. citizen a U.S. permanent resident or have protected status in the U.S. under asylum or refugee status or have the ability to obtain an export authorization.
Required Skills
Required Experience:
Senior IC
Employment Type
Full Time
Key Skills
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