- Lead NPI process from Concept to Mass Production at OSAT (especially QFP BGA).
- Define and implement Package Development Assembly and Testing for new PMIC products for Automotive.
- Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
- Ensure Manufacturability and Product Ramp-Up.
- Prepare and present reports on NPI project status risks and milestones.
- Drive Failure Analysis (FA) to identify Root Causes for issues.
- Perform Risk Assessments such as Failure Mode and Effects Analysis.
- Develop align and monitor Qualification Process.
- Interface to Quality Department for Quality Confirmation.
- Elaborate and define Data Exchange between OSAT and Continental for Traceability Quality. Assurance and Yield Monitoring.
- Establish Part Traceability Concepts.
- Conduct risk assessments and implement mitigation strategies
Qualifications :
- Degree in Electronics/Electrical Engineering (or relevant) with minimum five years working experience in semiconductor (e.g. process or product) or subcon management (e.g. Foundries or OSAT).
- Good knowledge in semiconductor manufacturing processes (e.g. wafer process technologies and package assembly) electronic testing (e.g. DFT Test Hardware Test Development) and automotive electronic qualification requirements (e.g. AEC-Q100/101).
- Preferable with strong technical proficiency in package and assembly processes.
- Good interpersonal and communication skills (e.g. Business English Presentations) to interact with internal and external stakeholders.
- Strong problem-solving skills results oriented and a quality-focused mindset.
- Team player with proactive attitude able to work independently and travel frequently.
Additional Information :
Ready to drive with Continental Take the first step and fill in the online application.
Remote Work :
No
Employment Type :
Full-time