drjobs Principal Engineer - Package/Board Design

Principal Engineer - Package/Board Design

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1 Vacancy
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Job Location drjobs

Noida - India

Monthly Salary drjobs

Not Disclosed

drjobs

Salary Not Disclosed

Vacancy

1 Vacancy

Job Description

We are looking for an experienced leader for high performance SOCs/MCUs for board and packaging group.

Essential Functions:

  • Highly experienced in board and package design from block level to final board and package delivery.
  • Should have the ability to work independently with little supervision and drive the team to define develop and execute the product plan from specification to release.
  • Must be a natural team player and strive towards fostering a highly creative and productive working environment

Qualifications :

Minimum Requirements:

  • MTech/BTech in EC/ EE/CS with hardware engineering experience of 4 to 15 years.
  • Experience in Microcontroller and Microprocessor based complex design
  • Experience in latest packaging Technologies and Manufacturing process
  • Strong domain knowledge of system clocking system modes power management debug

Additional Preferred Qualifications

  • Experience in IC packaging layout design emphasizing advanced technologies like SiP (SysteminPackage) flipchip and 3D packaging.
  • Comprehensive knowledge of packaging design aspects encompassing power distribution thermal control and signal fidelity. Thermal simulation experience is added advantage.
  • Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes.
  • Board level System architecture and design includes memory or communication interfaces.
  • SOC specifications and board level system specifications.
  • Development and design of SOC power supply system power supply specifications and PMIC specifications.
  • Interface specifications incorporating SOCperipheral devices
  • Experience with highspeed interface i.e. PCIe Gen3/4/5/ LPDDR 4/4x/5/5x UFS Ethernet Flash memory
  • Board level DC/AC simulations.
  • Schematic Layout and BOM generation using modern CAD tools
  • Experience with SoC Bringup activities
  • Familiarity with PCB technologies DFM DFA materials stackup design assembly rules and manufacturing process
  • Experience with tools: Ansys HFSS or Cadence SI/PI or other SI/PI Cadence APD (Allegro Package Designer) for IC package layout design SIwave HSPICE ADS Q3D
  • Ability to automate the SI PI and Packaging activities using scripting tools like Python TCL


Additional Information :

Renesas Electronics Corporation empowers a safer smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers Renesas combines our expertise in embedded processing analog power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive industrial infrastructure and IoT applications enabling billions of connected intelligent devices that enhance the way people work and live. Learn more at .

Renesas mission To Make Our Lives Easier is underpinned by our company culture TAGIE. TAGIE stands for Transparent Agile Global Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues customers and stakeholders.

Renesas Electronics is an equal opportunity and affirmative action employer committed to  supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics Corporation empowers a safer smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers Renesas combines our expertise in embedded processing analog power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive industrial infrastructure and IoT applications enabling billions of connected intelligent devices that enhance the way people work and live. Learn more at .

Renesas mission To Make Our Lives Easier is underpinned by our company culture TAGIE. TAGIE stands for Transparent Agile Global Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues customers and stakeholders.

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industrys leading expert in embedded processing with unmatched quality and systemlevel knowhow we have evolved to provide scalable and comprehensive semiconductor solutions for automotive industrial infrastructure and IoT industries based on the broadest product portfolio including High Performance Computing Embedded Processing Analog & Connectivity and Power.
 
With a diverse team of over 21000 professionals in more than 30 countries we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable powerefficient solutions today that help people and communities thrive tomorrow To Make Our Lives Easier.     
 
At Renesas you can: 

Are you ready to own your success and make your mark  

Join Renesas. Lets Shape the Future together.  

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.


Remote Work :

No


Employment Type :

Fulltime

Employment Type

Full-time

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