Sr ASIC Packaging Engineer Annapurna Labs
Sr ASIC Packaging Engineer Annapurna Labs
Posted on :
27-04-2025
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1 Vacancy
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Job Description
AWS Utility Computing (UC) provides product innovations that continue to set AWSs services and features apart in the industry. As a member of the UC organization youll support the development and management of Compute Database Storage Platform and Productivity Apps services in AWS including support for customers who require specialized security solutions for their cloud services. Additionally this role may involve exposure to and experience with Amazons growing suite of generative AI services and other cloud computing offerings across the AWS portfolio.
Annapurna Labs (our organization within AWS UC) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on technical challenges that have never been seen before and deliver results that help our customers change the world.
Annapurna Labs is looking for a Sr. Packaging Engineer. As a senior member of the team you will join a group of hardworking engineers to design and implement innovative next generation machine learning chips and servers. In this position you will make a real impact in a dynamic technology focused team. Your work will impact the growing field of machine learning.
You will collaborate with architects design teams software engineers to deliver the next generation ML chip. In this position you will have the opportunity to be responsible for IP integration 2.5D design bring up Characterization and validation.
Key job responsibilities
Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
Engage with product architect and design teams on future products package and assembly needs
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products
Engage with substrate and assembly vendors on future technologies roadmap
Product development and manufacturing:
Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs
Assume full ownership of mechanical and thermal performance of Annapurna ICs
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team
Work with Assembly Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
Track assembly and substrate yields and look for ways to improve them
About the team
About the team
Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures and were building an environment that celebrates knowledgesharing and mentorship. Our senior members enjoy oneonone mentoring and thorough but kind code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description we encourage candidates to apply. If your career is just starting hasnt followed a traditional path or includes alternative experiences dont let it stop you from applying.
About AWS
Amazon Web Services (AWS) is the worlds most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating thats why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.
Inclusive Team Culture
Here at AWS its in our nature to learn and be curious. Our employeeled affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences including our Conversations on Race and Ethnicity (CORE) and AmazeCon conferences inspire us to never stop embracing our uniqueness.
Work/Life Balance
We value worklife harmony. Achieving success at work should never come at the expense of sacrifices at home which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home theres nothing we cant achieve in the cloud.
Mentorship & Career Growth
Were continuously raising our performance bar as we strive to become Earths Best Employer. Thats why youll find endless knowledgesharing mentorship and other careeradvancing resources here to help you develop into a betterrounded professional.
. or . degree in Electrical Engineering Applied Physics or related fields
10 years of professional experience in similar role
Engage with product architect and design teams on future products package and assembly needs
Explore and provide recommendations on both available and future packaging substrate and technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
Product development and manufacturing:
Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs.
Ball maps and 3DIC C4/ubump studies
Assume full ownership of mechanical and thermal performance of Annapurna ICs.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.
High communication skills
Dive deep quickly into unfamiliar domains
Strong analytic and problemsolving skills
Ability to work independently on multiple issues
Good understanding of transmission line theory power delivery and signal integrity is desired.
Strong programming and scripting skills in Perl Python Tcl desired Cadence Skill and EXCEL familiarity are helpful.
Enthusiastic and able to work with a minimum of supervision.
Can solve complex technical problems.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Annapurna Labs (our organization within AWS UC) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on technical challenges that have never been seen before and deliver results that help our customers change the world.
Annapurna Labs is looking for a Sr. Packaging Engineer. As a senior member of the team you will join a group of hardworking engineers to design and implement innovative next generation machine learning chips and servers. In this position you will make a real impact in a dynamic technology focused team. Your work will impact the growing field of machine learning.
You will collaborate with architects design teams software engineers to deliver the next generation ML chip. In this position you will have the opportunity to be responsible for IP integration 2.5D design bring up Characterization and validation.
Key job responsibilities
Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
Engage with product architect and design teams on future products package and assembly needs
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products
Engage with substrate and assembly vendors on future technologies roadmap
Product development and manufacturing:
Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs
Assume full ownership of mechanical and thermal performance of Annapurna ICs
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team
Work with Assembly Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
Track assembly and substrate yields and look for ways to improve them
About the team
About the team
Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures and were building an environment that celebrates knowledgesharing and mentorship. Our senior members enjoy oneonone mentoring and thorough but kind code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description we encourage candidates to apply. If your career is just starting hasnt followed a traditional path or includes alternative experiences dont let it stop you from applying.
About AWS
Amazon Web Services (AWS) is the worlds most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating thats why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.
Inclusive Team Culture
Here at AWS its in our nature to learn and be curious. Our employeeled affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences including our Conversations on Race and Ethnicity (CORE) and AmazeCon conferences inspire us to never stop embracing our uniqueness.
Work/Life Balance
We value worklife harmony. Achieving success at work should never come at the expense of sacrifices at home which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home theres nothing we cant achieve in the cloud.
Mentorship & Career Growth
Were continuously raising our performance bar as we strive to become Earths Best Employer. Thats why youll find endless knowledgesharing mentorship and other careeradvancing resources here to help you develop into a betterrounded professional.
. or . degree in Electrical Engineering Applied Physics or related fields
10 years of professional experience in similar role
Engage with product architect and design teams on future products package and assembly needs
Explore and provide recommendations on both available and future packaging substrate and technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
Product development and manufacturing:
Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs.
Ball maps and 3DIC C4/ubump studies
Assume full ownership of mechanical and thermal performance of Annapurna ICs.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.
High communication skills
Dive deep quickly into unfamiliar domains
Strong analytic and problemsolving skills
Ability to work independently on multiple issues
Good understanding of transmission line theory power delivery and signal integrity is desired.
Strong programming and scripting skills in Perl Python Tcl desired Cadence Skill and EXCEL familiarity are helpful.
Enthusiastic and able to work with a minimum of supervision.
Can solve complex technical problems.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Required Experience:
Senior IC
Employment Type
Full-Time
Key Skills
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