Department Intro:

The Technology Development (TD) department at Micron Technology is at the forefront of innovation driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of nextgeneration semiconductor products. By collaborating closely with our global R&D and manufacturing teams we ensure the efficient transfer and implementation of new technology nodes maintaining Microns leadership in the industry. Join us to be part of a dynamic and forwardthinking team that is molding the future of technology!

Position Overview:

As a Staff Equipment Development Engineer in Microns Advanced Technology Packaging Development (APTD) team you will be responsible for developing and optimizing next generation first of a kind (FAOK) wafer and die equipment. Take ideas from conception through equipment and subcomponent development all the way to implementation in APTD and manufacturing facilities. You will also be required to identify diagnose and resolve equipment related problems by applying failure analysis FMEA 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes leading and participating in equipment maturity and availability improvement and cost reduction activities.

Micron is a highly collaborative atmosphere. This role responsibilities include interacting with various groups such as process development manufacturing and equipment vendors to ensure robust processes that meet the detailed physical requirements for Micron products. You will become a domain expert crafting post probe wafer and assembly technology roadmaps influencing Microns global leadership in semiconductor manufacturing.

Responsibilities:

• Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.

• Develop hardware roadmaps for 5 years in the area of post probe wafer and die processing.

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Microns products.

• Optimizing equipment to reduce cost increase availability and improve hardware and process capability.

• Collaborating with process development teams to develop innovative new solutions.

• Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.

• Performing fundamental research to drive innovative solutions for nextgeneration equipment products.

• Support equipment transfer to production facilities (some domestic or international travel may be .

Minimum Qualifications:

• Masters Degree or equivalent experience in Materials Science Chemical Engineering Electrical Engineering Mechanical Engineering Physics or other related technical fields

• 2 years of semiconductor process or equipment engineering experience

• Fundamental understanding of post probe and assembly process and equipment interactions.

• Understanding of related inline/electrical/probe failure.

• 2 years of experience with design of experiment techniques (DOE) Statistical Process Control (SPC) Defect analysis and data analysis

• Ability to resolve sophisticated issues through rootcause or modelbased problem solving and a focus on meeting commitments

• Hands on experience with wafer / assembly tools and overlay systems

Preferred Qualifications:

• Ph. D. in Mechanical Engineering Chemical Engineering Electrical Engineering or a related technical field or equivalent experience

• Knowledge of robotics machine logic language or new hardware deisgn is desirable.

• Wafer or die bonding plating warpage control and packaging field experience preferable