Sr Wafer Bonding Process Development Engineer - TPG

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

As a wafer bonding process engineer within our DRAM Technology Development organization at Micron Technology you will be part of a worldwide memory development organization. You will be responsible for developing wafer bonding process technology which will enable Micron to develop cutting edge memory technology. As a bonding process engineer you will be primarily responsible for starting up developing and optimizing bonding processes to improve product quality and reliability yield improvement cost reduction productivity improvement and risk management as well as resolving manufacturing line problems. Additional responsibilities include coordinating and carrying out process equipment and material evaluation/optimization to implement changes at process step leading and participating in yield improvement and cost reduction activities handling new process baseline qualifications and managing auditing and liaising with suppliers to achieve quality cost and risk management objectives.

Responsibilities include but not limited to:

• Drive design of experiments (DOEs) and analysis with tenacity in creating a process technology path towards definition of leading memory products in the market.
• Collaborate with cross functional teams for demonstration and development of advanced memory products.
• Engage with external vendors and research partners in expediting the process development schedule.
• Modelbased problem solving and drive innovation efforts through risk/ issues mitigation patents and papers.
• Identify diagnose and resolve assembly process related problems.
• Coordinate and execute process equipment and material evaluation / optimization initiatives and implement changes at process step.
• Lead / participate in continuous yield improvement and cost reduction activities.
• Validate and fan out new process baseline qualified including new process tools and/or materials for new product introduction.
• Support SPC/FDC/RMS/APC.
• Support site to site process transfers.

Minimum Requirements:

• 3 to 5 years of semiconductor process engineering experience in wafer bonding related process preferably in 300mm wafer fab.
• Knowledge of semiconductor processing solidstate device physics desirable

• Wafer bonding process development and equipment related experience required.
• Prior integration experience of 3D TSV microbumps temporary bonding/ debonding wafer thinning BS TSV reveal RDL dicing and hybrid bonding is preferred.
• Understanding of semiconductor devices processes and characterization techniques is preferred.
• Basic understanding of Customer needs with a focus in the Memory segment.
• Oral and written English communication.

Education & Experience:

M.S./Ph. D. (or equivalent education) in Materials Science Chemical Engineering Electrical Engineering Mechanical Engineering Chemistry Physics or other related technical fields.

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid timeoff program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

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