Semiconductor Jobs in Japan
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Electro-instrum. Techn.
Cascades
Allendale County - USA
Welcome to Cascades!At Cascades Sustainable Development means Respecting the True Nature of our 10000 talents. We put you first: Salary range for Electro-Instrum. Techn. $27.00/hr to $33.00/hr (based on skills experience and education)Schedule : Monday to Friday 7am to 4pm with on call rotationBoot...
Japan Semiconductor Product Specialist
Thermo Fisher Scientific
Tokyo - Japan
Work ScheduleStandard (Mon-Fri)Environmental ConditionsOfficeJob Description 職務内容Thermo Fisher Scientificのチームの一員としてシニアプロダクトスペシャリストを募集します本ポジションでは当社の革新的な製品群を通じて売上拡大と顧客の成功に貢献していただきます技術的な専門知識とコンサルティブな営業手法...
Semiconductor Principal Design Engineer
Micron
Tokyo - Japan
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.P...
Senior Associate Consultant Semiconductor Design E...
Infosys
Tokyo - Japan
-onlearningagendadrivestheircontinuousimprovementthroughbuildingandtransferringdigitalskillsexpertiseandideasfromourinnovationecosystem..JoinInfosysandbepartofaculturethatsnotjustpromiseditscertified.#TopEmployer2026#ThriveAtInfosysVisittoseehowInfosys(NYSE:INFY)canhelpyourenterprisenavigateyournext...
Semiconductor Principal Design Engineer, Nonvolati...
Micron
Tokyo - Japan
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.T...
Semiconductor Assembly Process Development Enginne...
Renesas Electronics
Yonezawa - Japan
募集背景当社では次世代パッケージ技術Flip ChipSiP などの開発を中心に半導体後工程における技術革新を積極的に推進しています特に AI高性能コンピューティングHPC車載IoT 分野においてはより高密度高信頼性高放熱性を備えたパッケージ技術が求められておりFCCSPFlip Chip Chip Scale Packageや FCBGA といった先端技術の...
Semiconductor Assembly Process Development Enginne...
Renesas Electronics
Nakatsu - Japan
募集背景当社では次世代パッケージ技術Flip ChipSiP などの開発を中心に半導体後工程における技術革新を積極的に推進しています特に AI高性能コンピューティングHPC車載IoT 分野においてはより高密度高信頼性高放熱性を備えたパッケージ技術が求められておりFCCSPFlip Chip Chip Scale Packageや FCBGA といった先端技術の...
Semiconductor Plant Engineer
Renesas Electronics
Kai - Japan
募集背景脱炭素社会の実現にむけて電力の制御や変換を行うパワー半導体はDXやGXの実現に必要不可欠なデバイスです当社ではパワー半導体の需要拡大を見据えパワー半導体の製造ラインとして甲府工場を再稼働させ新たな製品プロセス開発と量産化を進めています今回甲府工場において前任者の退職に伴い電気設備水処理ガスクリー...
