Semiconductor Assembly Process Technology Development Senior Engineer

You will be responsible for technology development tasks in the assembly and packaging of advanced semiconductor packages for AI HPC (High Performance Computing) automotive and IoT advanced semiconductor packages (such as Flip Chip Ball Grid Array and Power Semiconductor Packages).

• Development equipment selection and implementation of assembly technologies for advanced packages such as VPS FCCSP and FCBGA
• Development and improvement of materials and processes for assembly processes (SMT SPI AOI Flip Chip bonding Flux cleaning) 
• Support for Launching and Transitioning to Mass Production Lines
• Process quality and yield improvement activities 

Ou company is driving innovation in semiconductor packaging technologies including Flip Chip SiP VPS FCCSP and FCBGA. As demand continues to grow in AI HPC automotive and IoT applications advanced packages with higher density improved thermal performance and greater reliability are becoming increasingly important. 

To support the rapid expansion of these technologies we are seeking experienced engineers in semiconductor assembly and packaging this role you will contribute to the development of next-generation packages for AI/HPC ADAS and other advanced applications from package design and process development to product launch. This is an excellent opportunity to work on cutting-edge semiconductor technologies and play a key role in shaping future innovations.  

Qualifications :

Required Qualifications:

• Over 5 years of experience in technology development in semiconductor back-end processes (assembly and packaging)
• Over 5 years of technical development experience in any of the following processes: SMT SPI AOI Flip Chip bonding or Flux cleaning
• Practical experience in process improvement quality control and equipment introduction
• Technical Degrees (mechanical materials electronics chemistry etc.)
• Business-level proficiency in both Japanese and English

Preferred Qualifications:

• Practical experience in analyzing and improving defects using FTA 5Whys subsequent processes
• Experience in materials development such as material selection and optimization
• Experience in CAD design including jigs and tool design and optimization
• Knowledge of semiconductor technology standards such as IATF and JEDEC
• Practical experience as PM in product development

Additional Information :

ルネサスはTo Make Our Lives Easier人々の暮らしをより豊かで快適にするというPurposeのもと組込み半導体ソリューションを提供するグローバル企業です世界30か国以上で活躍する21000人を超えるエンジニアや課題解決のプロフェッショナルとともに自動車産業インフラIoT分野における世界最先端のテクノロジー開発に携わりより安全で健康的で環境にやさしくスマートな未来の実現に貢献しています 

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Remote Work :

No

Employment Type :

Full-time