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Software Engineering BSP Kernel


Job Location:

Bengaluru - India

Monthly Salary: Not provided by the employer
Posted: 13 October 2026 (12 hours ago)
Application Deadline: 10 January 2027
Vacancies: 1 Vacancy

Job Summary

HARMANs engineers and designers are creative purposeful and agile. As part of this team youll combine your technical expertise with innovative ideas to help drive cutting-edge solutions in the car enterprise and connected ecosystem. Every day you will push the boundaries of creative design and HARMAN is committed to providing you with the opportunities innovative technologies and resources to build a successful career.

A Career at HARMAN

As a technology leader that is rapidly on the move HARMAN is filled with people who are focused on making life better. Innovation inclusivity and teamwork are a part of our DNA. When you add that to the challenges we take on and solve together youll discover that at HARMAN you can grow make a difference and be proud of the work you do everyday.

About the Role

you will be involved in kernel development device driver integration board bring-up system debugging performance optimization and hardware-software integration activities. You will play a key role in delivering robust scalable and production-quality embedded Linux solutions for global automotive customers.

Your Team

You will be part of a highly skilled Linux Platform and BSP engineering team responsible for developing Automotive Infotainment platforms across multiple customer programs. You will collaborate closely with BSP architects kernel developers device driver engineers integration teams validation teams hardware teams and SoC vendors

What You Will Do

Linux Kernel & BSP Development

Develop customize maintain and debug Linux Kernel and BSP software for Automotive IVI platforms.

Develop integrate and maintain platform-specific software components.

Support kernel upgrades feature enablement and platform migrations.

Participate in architecture discussions and contribute to platform design reviews.

Design develop integrate and debug Linux device drivers. Support driver development for subsystems like Display Audio USB Storage Connectivity modules Sensors Vehicle interfaces etc

Work closely with hardware teams to enable and validate new peripherals and platform features.

Work with automotive and embedded SoCs including Qualcomm Samsung Exynos MediaTek NXP Renesas and TI platforms.

Perform root-cause analysis and resolution of Linux Kernel BSP and system-level issues including kernel crashes panics memory leaks driver defects boot-time/runtime failures and stability problems by analyzing kernel logs crash dumps trace data and open-source software components.

Drive system performance analysis and optimization by identifying and resolving bottlenecks related to CPU utilization memory consumption boot time responsiveness stability reliability and overall platform performance.

What You Need

Bachelors or masters degree in computer science Electronics Engineering Embedded Systems or a related technical discipline.

3-5 years of hands-on experience in Linux Kernel BSP and Embedded Software Development preferably in Automotive IVI or embedded platforms.

Strong expertise in Linux Kernel internals device driver development BSP customization board bring-up hardware-software integration and Embedded Linux architecture.

Proficient in Embedded C programming with knowledge of C and hands-on experience with Device Tree bootloader concepts and ARM-based architectures.

Good understanding of Linux Kernel subsystems including Memory Management Interrupt Handling IPC Filesystems and Power Management along with strong debugging and root-cause analysis skills.

Experience with debugging and profiling tools (GDB ftrace perf strace crash) Git-based development workflows CI/CD environments and communication interfaces such as SPI I2C UART and I2S etc

What is Nice to Have

Experience with Qualcomm Snapdragon Automotive platforms.

Experience with MediaTek Samsung NXP and TI automotive SoCs.

Experience in Automotive Infotainment (IVI) Cockpit or Digital Cockpit platforms.

Knowledge of automotive communication protocols and vehicle interfaces.

Experience with performance profiling tracing and system optimization tools.

Exposure to Hypervisor and Multi-OS environments.

Familiarity with Automotive Cybersecurity concepts.

Familiarity with Functional Safety (FuSa) concepts.

Experience working in ASPICE-compliant development environments.

What Makes You Eligible

Ability to lead teams and customer engagements.

Willingness to travel as required.

Passion for technical excellence and mentoring.

Contribute to continuous improvement of HARMANs architecture design processes

What We Offer

Hybrid work environment

Extensive training opportunities through our own HARMAN University

Competitive wellness benefits

An inclusive and diverse work environment that fosters and encourages professional and personal development

Work in a diversified cross culture project team with the biggest worldwide automotive OEM customers

HARMAN is proud to be an Equal Opportunity / Affirmative Action employer. All qualified applicants will receive consideration for employment without regard torace religion color national origin gender (including pregnancy childbirth or related medical conditions) sexual orientation gender identity gender expression age status as a protected veteran status as an individual with a disability or other applicable legally protected characteristics.


Required Experience:

IC


About Company

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Symphony Teleca Corporation is the world’s first services company dedicated exclusively to helping clients manage the global convergence of software, the cloud and connected devices. We deliver solutions for product and services innovation, with contemporary product development, syste ... View more

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