INRBAISMT Process EngineerIN

SMT Process programming and optimization 

create validate and release machine programs for Solder Paste Printing (SPP) SPI Pick & Place Reflow Oven and AOI.
stencil printing placement thermal profile and inspection parameters to achieve process capability targets.
and reduce cycle time changeover time and setup losses through continuous improvement initiatives.
program creation and validation processes across all SMT equipment

 Process Ownership & Standardization

implement and maintain SOPs work instructions control plans and process standards for SMT operations
control limits for paste height volume offset placement accuracy oven profile and AOI criteria
process compliance through periodic audits and process confirmations.
and update process documentation based on lessons learned and engineering changes

Quality & Defect reduction 

and improve solder paste deposition quality through SPI data analysis.
and eliminate SMT defects such as insufficient solder excess solder bridging tombstone skew missing components lifted leads solder balls and polarity errors.
solder joint quality through AOI and continuous defect trend monitoring
8D 5 Why Fishbone and PFMEA activities to prevent recurrence of quality issues

Machine Performance & Productivity  Improvement

SMT equipment utilization downtime and throughput performance.
corrective actions for recurring machine stoppages and process interruptions.
with maintenance teams for preventive maintenance calibration and breakdown reduction.
predictive and preventive measures to improve machine reliability.

New Product Introduction (NPI)

Gerber files BOM Pick and Place data stencil design and PCB layout for manufacturability.
DFM/DFA reviews for SMT feasibility.
pilot builds process validation thermal profiling and AOI library creation.
smooth product launch with optimized process settings from Day 1.

Process Engineering & Continuous Improvement

cycle-time analysis and reduce bottlenecks in SMT line.
continuous improvement initiatives such as Kaizen lean and waste elimination.
CPH and utilization
Industry 4.0 and data-driven process monitoring solutions.

Training & Skill Development

operators on SPP SPI Pick & Place Reflow and AOI operations.
2. Conduct skill assessments certification and refresher training

HSE and Safety  Compliance

1. Ensure safe working conditions in SMT  areas as per HSE standards
HIRA and risk assessments for SMT equipment and processes
safe handling of solder paste chemicals and ESD- sensitive components.

Qualifications :

Diploma - 8 years of SMT manufacturing experience with strong exposure to SMT operation and process engineering

BE/B Tech-  6 years of SMT manufacturing experience with strong exposure to SMT operation and process engineering

Remote Work :

No

Employment Type :

Full-time