Design Engineer Hardware Packaging

Design and development of electronic and electro-mechanical systems like
dashboard controller module converter modules charger sensors actuators for
various applications.
Testing and Validation of systems designed and interactions between them by
understanding the vehicle architecture.
Design and Development of enclosures in plastic sheet metal casting etc for
various electrical and electronic assemblies that are part of the vehicle and charging
infrastructure.
Responsible for ensuring manufacturability of electronic box build assembly
components and drive quality controls.
Make significant contributions to review of Tools Jigs Fixtures and End of Line test
equipment at supplier locations.
Responsible for Electromechanical Interaction and Impact Analysis and experience
in Tolerance stack-up.
Regression testing including Thermals Sealing Vibration Shock and structural
tests across 3D Printed prototypes and off the tool and process samples and DVT of
electronic packaging enclosures and electrical harness.
Maximize reuse of platforms and design resources to help reduce TTM cost and to
enhance quality; implement lessons learnt into designs.
Participate in and contribute to DFMEA DFM DFA DFC DFS DFR and component
selection/derating reviews carry out RCA on field failures and
implement/recommend CAPA.
Participate in regulatory tests such as UL ARAI BIS IEC standards for
electrical/electronic assemblies.
Performing Problem solving using industry best practices such as 5-Why analysis
Fishbone diagram RCA methodologies etc..
Project execution following PMP Agile methodologies
HERE S WHAT WE ARE LOOKING FOR:
Experience in designing plastics and sheet-metal for electro-mechanical enclosures
with attention to electromechanical interactions.
Experience in material selection manufacturing process for Plastics sheet metal
and casting.
Advanced knowledge in fasteners inserts surface treatment methodologies and
engineering plastics used for electronic packaging.
Knowledge of Geometric Dimensioning & Tolerancing generation of First Article
Report (FAR)
Knowledge of DFMEA PFMEA AFMEA DFM DFA DFC DFR DFS Poka-Yoke
methods and techniques sealing and venting mechanisms
Experience of working in at least one complete product development life
cycle.
Knowledge on APQP PFMEA and basics of tool design will be an added
advantage .
Exposure to PPAP and Supplier quality audits .
Understanding of electronics components will be an added advantage.
Exposure to PCBA interaction and packaging of the same in an enclosure
considering the power dissipation EMI/EMC requirements
Knowledge on Thermal design including interface materials and simulation
will be an added advantage
Experience with working on SW tools such as Siemens NX PLM Tools (
Teamcenter JIRA etc..) FMEA tools Pugh Matrix and Basic understanding of
CAE tools such as Ansys/Fluent.
A good team player with interpersonal planning and go