PCB Design Senior Engineer

The Role:

We are looking for a Senior PCB Design Engineer with strong EDA library ownership and advanced highspeed board design experience to drive the implementation of our nextgeneration data center accelerator platforms.

In this role you will be responsible for the complete PCB design process from library definition and design rules through floorplanning routing and tapeout while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks PDN strategies and constraints.

This is a handson technically demanding role focused on very highdensity highlayercount boards pushing the limits of power delivery memory integration and highspeed interfaces using Siemens Xpedition as the primary design environment.

Key Responsibilities:

Design and layout complex highlayercount PCBs for accelerator and data center platforms

Own and maintain EDA libraries (symbols footprints padstacks constraints)

Define routing constraints and complex design rules for highspeed and highpower designs

Collaborate with SI/PI teams on layer stackups impedance control and PDN design

Collaborate with mechanical and thermal experts to ensure design integration

Drive designs from concept through tapeout including manufacturing deliverables

Support DFM reviews board bringup and hardware debug activities

Required Qualifications:

Bachelors and Masters degree in Electrical Engineering or related field.

5 years of handson PCB layout experience in complex hardware programs.

Strong experience with Siemens Xpedition (layout and library tools strongly preferred).

Proven background designing highspeed highlayercount boards.

Solid understanding of:

-Signal Integrity and Power Integrity fundamentals

-Controlled impedance routing

-Highdensity interconnects and advanced packages

Experience creating and maintaining EDA component libraries.

Ability to work effectively with crossfunctional teams (SI PI schematic ME manufacturing).

Preferred Qualifications:

Experience with datacenter accelerator networking or HPC hardware.

Direct involvement in memory subsystem integration and highspeed serial interfaces.

Familiarity with SI/PI simulation workflows and constraintdriven design.

Experience defining layer stacks in collaboration with fabricators and SI/PI teams.

Knowledge of DFM/DFT/DFX principles for highvolume and advanced PCB manufacturing.

Comfortable working in fastmoving technically ambitious engineering environments.

What do we offer

Join an innovative team and experience company growth.

We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers.

Enjoy a hybrid work environment.

We also offer flexible schedule.

We offer a remuneration that values your experience.

The position will have preferably the base in Karlsruhe (Germany).

We are looking for outstanding people willing to join our mission to change this industry and help to build a better world.

If you feel identified with Openchip please contact us. We can offer a competitive compensation package in a flexible work schema that will help you to keep a balance between your personal and professional life.

At Openchip & Software Technologies S.L. we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued respected and empowered to reach their full potential regardless of race gender ethnicity sexual orientation or gender identity.