(Sr.) Staff Package Design Engineer MIS substrateFC expose die Experienced in Power or Gan is requried )

Key Responsibilities

Benchmark select and qualify suitable materials processes and assembly subcontractors (OSAT) or contract manufacturers (CM).

Work with OSAT/CM  to develop run DOE to optimize processes establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.

Work with Product groups and Reliability team qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing Product groups Quality and Operations organization to satisfy growth in businesses.

Ensure smooth transition into production & implement ramp up monitor.  

Participate in packaging roadmap development & focus on execution develop and maintain technical expertise on advances and innovations in power SiP/modules wafer level packaging flip chip interconnects and panel level package.

Establish & maintain package design rules.

Qualifications :

Qualifications and Skills

Doctorate/Masters / Bachelors degree in Physics Chemistry Mechanical Electrical or Materials Engineering.

>10 years of relevant experience in package development emphasizing power SiP/module wafer level & flip-chip packaging.

Strong understanding of power SiP/modules wafer level/flip-chip packaging methods assembly process knowledge qualification methods SPC and statistical analysis software.

Strong interpersonal and communication skills.

Strong analytical and presentation skills.

Knowledge of wire-bonding & multi-chip module technologies is a plus.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Remote Work :

No

Employment Type :

Full-time